SLVSHI4A October   2025  – December 2025 DRV81545

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Clamp Diode, VCLAMP
      2. 6.3.2 Protection Circuits
        1. 6.3.2.1 ILIM Analog Current Limit
          1. 6.3.2.1.1 Effect of Load Resistance on Power Dissipation Before TSD
        2. 6.3.2.2 Cut-Off Delay (COD)
        3. 6.3.2.3 Thermal Shutdown (TSD)
        4. 6.3.2.4 Undervoltage Lockout (UVLO)
      3. 6.3.3 Fault Conditions Summary
    4. 6.4 Device Functional Modes
      1. 6.4.1 Hardware Interface Operation
      2. 6.4.2 Parallel Outputs
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 External Components
      2. 7.2.2 Continuous Current Capability
      3. 7.2.3 Power Dissipation
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

6.3.3 Fault Conditions Summary

Table 6-4 summarizes the fault conditions and how to recover from each condition. Additionally, the nFAULT pin is pulled low momentarily when the device first wakes up (VM > VUVLO(rising)). After time tnFAULT_VALID the nFAULT pin accurately reports any fault states, but during the tnFAULT_VALID time the microcontroller can ignore any nFAULT low signals.

Table 6-4 Fault Conditions Summary
FAULT NFAULT PIN RECOVERY
Channel Overtemperature, TJ_CHx > TTSD Pulled Low TJ < (TTSD – TTSD_HYS)
Global (Die) Overtemperature, TJ > TTSD Pulled Low TJ < (TTSD – TTSD_HYS)
COD time expiry, when COD enabled Pulled Low tRETRY elapses
VM Undervoltage (UVLO), VVM < VUVLO VM falling Internal circuits disabled VVM > VUVLO VM rising