SLVSHI4A October   2025  – December 2025 DRV81545

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Integrated Clamp Diode, VCLAMP
      2. 6.3.2 Protection Circuits
        1. 6.3.2.1 ILIM Analog Current Limit
          1. 6.3.2.1.1 Effect of Load Resistance on Power Dissipation Before TSD
        2. 6.3.2.2 Cut-Off Delay (COD)
        3. 6.3.2.3 Thermal Shutdown (TSD)
        4. 6.3.2.4 Undervoltage Lockout (UVLO)
      3. 6.3.3 Fault Conditions Summary
    4. 6.4 Device Functional Modes
      1. 6.4.1 Hardware Interface Operation
      2. 6.4.2 Parallel Outputs
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 External Components
      2. 7.2.2 Continuous Current Capability
      3. 7.2.3 Power Dissipation
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8.4 Trademarks

PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.