SLVSIC6 August   2026 DRV81325-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
    1.     Pin Functions
  6. 5Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Transient Thermal Impedance & Current Capability
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
      1. 6.2.1 Control interface / Power input
      2. 6.2.2 Shunt sensing support
      3. 6.2.3 Paralleling of channels
    3. 6.3 Protection Circuits
      1. 6.3.1 Overvoltage clamp
        1. 6.3.1.1 Demagnetization energy capability
      2. 6.3.2 Single pulse clamping capability
      3. 6.3.3 Overcurrent limit
        1. 6.3.3.1 Current limiting when channels paralleled
      4. 6.3.4 Thermal Shutdown (TSD)
        1. 6.3.4.1 Dynamic Overtemperature Stress (ΔTDYN)
        2. 6.3.4.2 Absolute Overtemperature (TSD)
      5. 6.3.5 Undervoltage Lockout (UVLO)
      6. 6.3.6 Summary of STATUS pin response
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 External Components
    3. 7.3 Transient thermal performance
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
    5. 7.5 Thermal Consideration
      1. 7.5.1 Power Dissipation
      2. 7.5.2 Heatsinking
  9. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Community Resources
    3. 7.3 Trademarks
  10.   Mechanical, Packaging, and Orderable Information

7.3 Transient thermal performance

Figure 7-3 1(1s0p) Layer PCB with increasing copper area - D package
Figure 7-5 4(2s2p) Layer PCB with increasing copper area - D package
Figure 7-4 1(1s0p) Layer PCB with increasing copper area - DDA package
Figure 7-6 4(2s2p) Layer PCB with increasing copper area - D package