SLVSJP8 October   2025 TRF3302-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - GPS L1 Band
    6. 5.6 Electrical Characteristics - GPS L5 and L2 Bands
    7. 5.7 Typical Characteristics – GPS L1 Band
    8. 5.8 Typical Characteristics – GPS L5 and L2 Bands
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 The TRF3302-Q1 in a Multiband Configuration
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Typical Characteristics – GPS L1 Band

at TA = 27°C, VCC = 2.5V, f = 1575MHz (L1 band), source impedance (ZS) = load impedance (ZL) = 50Ω, input matched to 50Ω with L1 = 8.2nH (0402DC-8N2XGRW) and C1 = 10pF (GJM1555C1H100JB01) with input and output configuration as shown in Figure 6-2, de-embedded up to capacitor, C1, on input and RFOUT pin on the output, ambient temperatures shown (unless otherwise noted)

TRF3302-Q1 Power Gain (S21) Across VCC
PIN = –27dBm
Figure 5-1 Power Gain (S21) Across VCC
TRF3302-Q1 Reverse Isolation (S12) Across VCC
PIN = –27dBm
Figure 5-3 Reverse Isolation (S12) Across VCC
TRF3302-Q1 NF Across VCC
 
Figure 5-5 NF Across VCC
TRF3302-Q1 Power Gain (S21) Across Temperature
VCC = 1.8V, PIN = –27dBm
Figure 5-7 Power Gain (S21) Across Temperature
TRF3302-Q1 Reverse Isolation (S12) Across Temperature
VCC = 1.8V, PIN = –27dBm
Figure 5-9 Reverse Isolation (S12) Across Temperature
TRF3302-Q1 In-Band IIP3 vs Input Power (Pin) Across Temperature
VCC = 1.8V, 5MHz tone spacing
Figure 5-11 In-Band IIP3 vs Input Power (Pin) Across Temperature
TRF3302-Q1 Power Gain (S21) Across Temperature
VCC = 3.3V, PIN = –27dBm
Figure 5-13 Power Gain (S21) Across Temperature
TRF3302-Q1 Reverse Isolation (S12) Across Temperature
VCC = 3.3V, PIN = –27dBm
Figure 5-15 Reverse Isolation (S12) Across Temperature
TRF3302-Q1 In-Band IIP3 vs Input Power (PIN) Across Temperature
VCC = 3.3V, 5MHz tone spacing
Figure 5-17 In-Band IIP3 vs Input Power (PIN) Across Temperature
TRF3302-Q1 In-Band IM3 vs Input Power (PIN) Across VCC
5MHz tone spacing
Figure 5-19 In-Band IM3 vs Input Power (PIN) Across VCC
TRF3302-Q1 Out-of-Band IM3 vs Input Power (PIN) Across VCC
f1 = 1713MHz, f2 = 1851MHz
Figure 5-21 Out-of-Band IM3 vs Input Power (PIN) Across VCC
TRF3302-Q1 NF vs Temperature Across Frequency
VCC = 2V
Figure 5-23 NF vs Temperature Across Frequency
TRF3302-Q1 IP1dB vs VCC Across Temperature With Jammer
fJAM = 850MHz, PJAM = –20dBm
Figure 5-25 IP1dB vs VCC Across Temperature With Jammer
TRF3302-Q1 Output Power (PO) vs Input Power (PIN) Across Jammer and VCC
 
Figure 5-27 Output Power (PO) vs Input Power (PIN) Across Jammer and VCC
TRF3302-Q1 Gain and ICC vs PIN Across VCC
 
Figure 5-29 Gain and ICC vs PIN Across VCC
TRF3302-Q1 Input Return Loss (S11) Across VCC
PIN = –27dBm
Figure 5-2 Input Return Loss (S11) Across VCC
TRF3302-Q1 Output Return Loss (S22) Across VCC
PIN = –27dBm
Figure 5-4 Output Return Loss (S22) Across VCC
TRF3302-Q1 IP1dB vs VCC Across Temperature
 
Figure 5-6 IP1dB vs VCC Across Temperature
TRF3302-Q1 Input Return Loss (S11) Across Temperature
VCC = 1.8V, PIN = –27dBm
Figure 5-8 Input Return Loss (S11) Across Temperature
TRF3302-Q1 Output Return Loss (S22) Across Temperature
VCC = 1.8V, PIN = –27dBm
Figure 5-10 Output Return Loss (S22) Across Temperature
TRF3302-Q1 Output Power (PO) vs Input Power (PIN) Across Temperature
VCC = 1.8V
Figure 5-12 Output Power (PO) vs Input Power (PIN) Across Temperature
TRF3302-Q1 Input Return Loss (S11) Across Temperature
VCC = 3.3V, PIN = –27dBm
Figure 5-14 Input Return Loss (S11) Across Temperature
TRF3302-Q1 Output Return Loss (S22) Across Temperature
VCC = 3.3V, PIN = –27dBm
Figure 5-16 Output Return Loss (S22) Across Temperature
TRF3302-Q1 Output Power (PO) vs Input Power (PIN) Across Temperature
VCC = 3.3V
Figure 5-18 Output Power (PO) vs Input Power (PIN) Across Temperature
TRF3302-Q1 Out-of-Band IIP3 vs Input Power (PIN) Across VCC
f1 = 1713MHz, f2 = 1851MHz
Figure 5-20 Out-of-Band IIP3 vs Input Power (PIN) Across VCC
TRF3302-Q1 Out-of-Band IM3 vs Input Power (PIN) Across Temperature
VCC = 2V, f1 = 1713MHz, f2 = 1851MHz
Figure 5-22 Out-of-Band IM3 vs Input Power (PIN) Across Temperature
TRF3302-Q1 NF vs Jammer Power (PJAM) Across Jammer Frequency (fJAM)
VCC = 3.3V
Figure 5-24 NF vs Jammer Power (PJAM) Across Jammer Frequency (fJAM)
TRF3302-Q1 IP1dB vs VCC Across Temperature With Jammer
fJAM = 1850MHz, PJAM = –20dBm
Figure 5-26 IP1dB vs VCC Across Temperature With Jammer
TRF3302-Q1 ICC vs VCC Across Temperature
PIN = –35dBm
Figure 5-28 ICC vs VCC Across Temperature
TRF3302-Q1 ICC vs Temperature Across VCC
PIN = –35dBm
Figure 5-30 ICC vs Temperature Across VCC