SLVSJP8 October   2025 TRF3302-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics - GPS L1 Band
    6. 5.6 Electrical Characteristics - GPS L5 and L2 Bands
    7. 5.7 Typical Characteristics – GPS L1 Band
    8. 5.8 Typical Characteristics – GPS L5 and L2 Bands
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 The TRF3302-Q1 in a Multiband Configuration
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TRF3302-Q1 UNIT
VBL (WSON-FCRLF)
6 PINS
RθJA Junction-to-ambient thermal resistance 152.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78.5 °C/W
RθJB Junction-to-board thermal resistance 44.2 °C/W
ΨJT Junction-to-top characterization parameter 2.9 °C/W
ΨJB Junction-to-board characterization parameter 44.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.