SLVSLM8 May   2026 BQ78709-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information BQ78709-Q1
    5. 6.5  Supply Current
    6. 6.6  Digital I/O
    7. 6.7  REGOUT LDO
    8. 6.8  Voltage References
    9. 6.9  Coulomb Counter
    10. 6.10 Coulomb Counter Digital Filter
    11. 6.11 Current Wake Detector
    12. 6.12 Analog-to-Digital Converter
    13. 6.13 Cell Voltage Measurement Accuracy
    14. 6.14 Cell Balancing
    15. 6.15 Internal Temperature Sensor
    16. 6.16 Thermistor Measurement
    17. 6.17 Hardware Overtemperature Detector
    18. 6.18 Internal Oscillator
    19. 6.19 Charge and Discharge FET Drivers
    20. 6.20 Comparator-Based Protection Subsystem
    21. 6.21 Timing Requirements - I2C Interface, 100kHz Mode
    22. 6.22 Timing Requirements - I2C Interface, 400kHz Mode
    23. 6.23 Timing Diagram
    24. 6.24 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Configuration
      1. 7.3.1 Commands and Subcommands
      2. 7.3.2 Configuration Using OTP or Registers
      3. 7.3.3 Device Security
    4. 7.4 Device Hardware Features
      1. 7.4.1  Voltage ADC
      2. 7.4.2  Coulomb Counter and Digital Filters
      3. 7.4.3  Protection FET Drivers
      4. 7.4.4  Voltage References
      5. 7.4.5  Multiplexer
      6. 7.4.6  LDOs
      7. 7.4.7  Standalone Versus Host Interface
      8. 7.4.8  ALERT Pin Operation
      9. 7.4.9  Low Frequency Oscillator
      10. 7.4.10 I2C Serial Communications Interface
    5. 7.5 Measurement Subsystem
      1. 7.5.1 Voltage Measurement
        1. 7.5.1.1 Voltage ADC Scheduling
        2. 7.5.1.2 Unused VC Pins
        3. 7.5.1.3 General Purpose ADCIN Functionality
      2. 7.5.2 Current Measurement and Charge Integration
      3. 7.5.3 Internal Temperature Measurement
      4. 7.5.4 Thermistor Temperature Measurement
      5. 7.5.5 Factory Trim and Calibration
    6. 7.6 Protection Subsystem
      1. 7.6.1 Protections Overview
      2. 7.6.2 Primary Protections
      3. 7.6.3 CHG Detector
      4. 7.6.4 Cell Open-Wire Protection
      5. 7.6.5 Diagnostic Checks
    7. 7.7 Cell Balancing
    8. 7.8 Device Operational Modes
      1. 7.8.1 Overview of Operational Modes
      2. 7.8.2 NORMAL Mode
      3. 7.8.3 SLEEP Mode
      4. 7.8.4 DEEPSLEEP Mode
      5. 7.8.5 SHUTDOWN Mode
      6. 7.8.6 CONFIG_UPDATE Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plot
      4. 8.2.4 Random Cell Connection Support
      5. 8.2.5 Startup Timing
      6. 8.2.6 FET Driver Turn-Off
      7. 8.2.7 Usage of Unused Pins
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

6.3 Recommended Operating Conditions

Typical values stated where TA = 25°C and VBAT = 25.9V, min/max values stated where TA = -40°C to 125°C and VBAT = 3V to 38.5V (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VBATSupply voltageVoltage on BAT pin (normal operation)338.5V
VBAT(UVLO)Under voltage lockout levelFalling voltage on BAT causing device reset2.5V
VWAKEONTSWake on TS voltageVoltage on BAT pin in valid range0.651.2V
VWAKEONVC0Wake on VC0 voltageVoltage on BAT pin in valid range0.651.2V
VINInput voltage rangeALERT, SCL, SDA05.5V
VINInput voltage range (with ADC measurements)TS–0.21.8V
VINInput voltage rangeSRP, SRN, SRP-SRN (while measuring current)–0.20.2V
VINInput voltage rangeSRP, SRN (without measuring current)–0.21.8V
VINInput voltage range(3)VVC(0)–0.23.0V
VINInput voltage rangeVVC(x), 1 ≤ x ≤ 4maximum of VVC(x–1) – 0.2 or VSS – 0.2minimum of VVC(x–1)+5.5 or VSS + 38.5V
VINInput voltage rangeVVC(x), x ≥ 5maximum of VVC(x–1) – 0.2 or VSS + 2.0minimum of VVC(x–1) + 5.5 or VSS + 38.5V
VOOutput voltage rangeCHG–2538.5V
VOOutput voltage rangeDSG–0.214V
ICBCell balancing current (internal, per cell)(3)050mA
RCExternal cell input resistance(2)(3)101000Ω
CCExternal cell input capacitance(2)(3)0.110µF
RfExternal supply filter resistance (BAT pin)(3)501000Ω
CfExternal supply filter capacitance (BAT pin)(3)140µF
RfiltSense resistor filter resistance(3)100200Ω
CREGSRCREGSRC capacitance(3)1µF
RTSExternal thermistor nominal resistance (103-AT) at 25°C10kΩ
TOPRJunction temperature during operation(1)–40125°C
(1) Power dissipated within device must be limited to ensure junction temperature remains within specification during operation.
(2) External cell input resistance times external input capacitance must be limited to 200µs or below.
(3) Specified by design.