SLVUD68B March   2025  – October 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Connection Descriptions
      1. 2.1.1 Connections and Test Points
      2. 2.1.2 Jumper Configurations
  8. 3Implementation Results
    1. 3.1 Variable Resistor for CS and CL
      1. 3.1.1 Current Sense Resistor
      2. 3.1.2 Adjustable Current Limit
  9. 4Hardware Design Files
    1. 4.1 HCXX-BASE-EVM and 2HC08-MOD-EVM Schematic
    2. 4.2 HCXX-BASE-EVM and 2HC08-MOD-EVM Assembly Drawings and Layout
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Revision History

1.1 Introduction

Texas Instruments' HCXX-BASE-EVM evaluation module has a central socket for the supporting daughtercard with the high-side switch device. The EVM supports the single-channel and dual-channel low RON (≤50mΩ) high-side driver applications. The purpose of this EVM is to facilitate evaluation of the low RON high-side switches for the diagnostic features and drive resistive, capacitive, and inductive loads. The base station has all connectors, jumpers, and test points. The module has footprints to support the low RON family of TI's high-side switch portfolio.

Compatible Modules:

  • BLANK-MOD-EVM
  • 2HC08-MOD-EVM
  • 2HC16-MOD-EVM
  • 1HC08-MOD-EVM
  • 1HC04-MOD-EVM
  • 1HC03-MOD-EVM

Each device in the TPSxHCxx high-side switch family has a daughtercard. An additional blank EVM is available for application purposes. The daughtercard orderable part number begins with the channel count and on-resistance to match the device under testing. The layout and schematic for each daughtercard are the same for each EVM. The only change needed to activate the single channel feature on the base station is moving the resistor on the output to short the channels. This jumper is identified throughout this user guide.