SLVUD68B March 2025 – October 2025
The design of the HCXX-BASE-EVM and 2HC08-MOD-EVM printed-circuit board (PCB) is shown in Figure 4-2 to Figure 4-5. The EVM is designed using FR4 material, four-layer (2s2p), 2 × 70µm cubic inch top and bottom layers, and 2 × 35µm cubic inch internal plane layers. All components are in an active area on the top side and all active traces are in the top and bottom layers to allow the user to easily view, probe, and evaluate. Moving components to both sides of the PCB offers additional size reduction for space-constrained systems.
Figure 4-2 HCXX-BASE-EVM and 2HC08-MOD-EVM First Layer (Top
View)
Figure 4-3 HCXX-BASE-EVM and 2HC08-MOD-EVM Second Layer GND (Top
View)
Figure 4-4 HCXX-BASE-EVM and 2HC08-MOD-EVM Third Layer VCC (Top
View)
Figure 4-5 HCXX-BASE-EVM and 2HC08-MOD-EVM Fourth Layer (Top
View)