SLVUD95 May   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Best Practices
      1.      General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  8. 3Implementation Results
    1. 3.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5References

PCB Layouts

TPS7H6101EVM Top
                                                  Solder Mask (TPS7H6101EVM) Figure 4-3 Top Solder Mask (TPS7H6101EVM)
TPS7H6101EVM Top Overlay
                    (TPS7H6101EVM) Figure 4-4 Top Overlay (TPS7H6101EVM)
TPS7H6101EVM Top Layer
                    (TPS7H6101EVM) Figure 4-5 Top Layer (TPS7H6101EVM)
TPS7H6101EVM Signal Layer 1 (TPS7H6101EVM) Figure 4-6 Signal Layer 1 (TPS7H6101EVM)
TPS7H6101EVM Signal Layer 2
                    (TPS7H6101EVM) Figure 4-7 Signal Layer 2 (TPS7H6101EVM)
TPS7H6101EVM Signal Layer 3
                    (TPS7H6101EVM) Figure 4-8 Signal Layer 3 (TPS7H6101EVM)
TPS7H6101EVM Signal Layer 4
                    (TPS7H6101EVM) Figure 4-9 Signal Layer 4 (TPS7H6101EVM)
TPS7H6101EVM Signal Layer 5
                    (TPS7H6101EVM) Figure 4-10 Signal Layer 5 (TPS7H6101EVM)
TPS7H6101EVM Signal Layer 6
                    (TPS7H6101EVM) Figure 4-11 Signal Layer 6 (TPS7H6101EVM)
TPS7H6101EVM Bottom Layer (TPS7H6101EVM) Figure 4-12 Bottom Layer (TPS7H6101EVM)
TPS7H6101EVM Bottom Overlay
                    (TPS7H6101EVM) Figure 4-13 Bottom Overlay (TPS7H6101EVM)
TPS7H6101EVM Bottom Solder
                    (TPS7H101EVM) Figure 4-14 Bottom Solder (TPS7H101EVM)
TPS7H6101EVM Drill Drawing
                    (TPS7H6101EVM) Figure 4-15 Drill Drawing (TPS7H6101EVM)