SLVUDB3 July   2025 BQ25176K

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 I/O Descriptions
    2. 2.2 Printed Circuit Board Assembly
    3. 2.3 Best Practices
    4. 2.4 Test Summary
      1. 2.4.1 Equipment
      2. 2.4.2 Cautions
      3. 2.4.3 Test Instructions
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 Board Layout
    3. 3.3 Bill of Materials
  9. 4Additional Information
    1.     Trademarks

3.2 Board Layout

The board layout is shown in Figure 3-2 to Figure 3-8.

BQ25176KEVM Top Overlay Figure 3-2 Top Overlay

BQ25176KEVM Top Solder

Figure 3-3 Top Solder

BQ25176KEVM Top Layer

Figure 3-4 Top Layer

BQ25176KEVM Bottom Layer

Figure 3-5 Bottom Layer

BQ25176KEVM Bottom Solder

Figure 3-6 Bottom Solder

BQ25176KEVM Bottom Overlay

Figure 3-7 Bottom Overlay

BQ25176KEVM Drill Drawing

Figure 3-8 Drill Drawing