SLVUDD4 November   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2EVM Quick Start
    1. 2.1 Hardware Setup
    2. 2.2 Software Setup
      1. 2.2.1 TICS Pro GUI Setup
      2. 2.2.2 Power Up Sequence
    3. 2.3 EVM Measurements
  8. 3Hardware
    1. 3.1 Device Operation Modes
    2. 3.2 EVM Configuration
      1. 3.2.1 Power Supply
      2. 3.2.2 Logic Input and Outputs
      3. 3.2.3 Clock Input
      4. 3.2.4 Clock Outputs
      5. 3.2.5 Status Outputs, LEDs, and Test Points
  9. 4Software
    1. 4.1 TICS Pro 2 LMKDB1112 Software
      1. 4.1.1 Input
        1. 4.1.1.1 Input Interface Type
        2. 4.1.1.2 Input Termination
        3. 4.1.1.3 Automatic Output Disable (AOD)
        4. 4.1.1.4 LOS Event
        5. 4.1.1.5 LOS Readback
      2. 4.1.2 Device Info and EVM Setup
        1. 4.1.2.1 Device Info
        2. 4.1.2.2 EVM Setup
        3. 4.1.2.3 SMBus
      3. 4.1.3 Output
        1. 4.1.3.1 SMBus
          1. 4.1.3.1.1 Programmable Output Slew Rate Control
        2. 4.1.3.2 OE Pin Control
        3. 4.1.3.3 Side Band Interface (SBI)
  10. 5Implementation Results
    1. 5.1 Typical Phase Noise Characteristic
  11. 6Hardware Design Files
    1. 6.1 Schematics
    2. 6.2 PCB Layouts
    3. 6.3 Bill of Materials (BOM)
  12. 7Compliance Information
    1. 7.1 Compliance and Certifications
  13. 8References

6.2 PCB Layouts

LMKDB1112EVM Layer Stackup Figure 6-9 Layer Stackup
LMKDB1112EVM Top Layer (CLKIN / CLKOUT Signals) Figure 6-10 Top Layer (CLKIN / CLKOUT Signals)
LMKDB1112EVM Bottom Layer Figure 6-11 Bottom Layer
LMKDB1112EVM Signal 1 Layer Figure 6-12 Signal 1 Layer
LMKDB1112EVM PWR Layer Figure 6-13 PWR Layer
LMKDB1112EVM GND 1 Layer Figure 6-14 GND 1 Layer
LMKDB1112EVM GND 2 Layer Figure 6-15 GND 2 Layer