SLVUDH9 March   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Description
    2. 2.2 Power Requirements
      1. 2.2.1 Power Tree
        1. 2.2.1.1 On-Board Power Supplies
        2. 2.2.1.2 Analog Voltage Reference
        3. 2.2.1.3 Alternative Power Sources
          1. 2.2.1.3.1 USB Isolation
          2. 2.2.1.3.2 External Power Connections
          3. 2.2.1.3.3 5V Step-Up Converter
      2. 2.2.2 Power Indicator LEDs
    3. 2.3 Reset
    4. 2.4 Clock
    5. 2.5 Interfaces
      1. 2.5.1 User LEDs
      2. 2.5.2 MCAN
      3. 2.5.3 Encoder Connectors
    6. 2.6 Debug Interface
      1. 2.6.1 XDS110 Debug Probe
      2. 2.6.2 Virtual COM Port
      3. 2.6.3 ARM 10-Pin Debug Header
    7. 2.7 Test Points
    8. 2.8 BoosterPacks
  9. 3Additional Information
    1. 3.1 Revision E1 Appendix
      1. 3.1.1 Revision E1 Known Issues
    2. 3.2 Revision E2 Appendix
      1. 3.2.1 Revision E2 Changes from E1
    3. 3.3 Trademarks

2.2 Power Requirements

The AM13E230x LaunchPad has several power domains that can be connected or isolated from each other with removable shunts on the EVM. The power domains are described in Figure 2-2.

LP-AM13E230 LP-AM13E230 Power Input and Distribution Diagram Figure 2-2 LP-AM13E230 Power Input and Distribution Diagram

Table 2-1 describes the usage of different removable shunts on the LaunchPad to connect or isolate different power domains.

Table 2-1 LP-AM13E230 Power Domain Shunts
Shunt Designator Usage Description
JP1, +5V0 Connects the +5V power from the USB-C connector (+5V0_USB) to the +5-V power on the XDS side of the board (+5V0_XDS110). Bridges the power isolation between the USB and XDS planes
JP1, GND Connects the board Ground on the isolated USB-C connector side of the board (USB_GND) to the rest of the board ground (GND). Bridges the ground isolation between the USB side and the rest of the board.
JP4, +5V0 Connects the +5-V power from the XDS side of the board (+5V0_XDS110) to the +5-V power on the MCU side of the board (+5V0_MCU).
JP4, +3V3 Connects the +3.3-V power from the XDS side of the board (+3V3_XDS110) to the +3.3-V power on the MCU side of the board (+3V3_MCU).
J13 Enables the onboard 3.3V to 5V BOOST regulator to convert the +3.3V power rail to a +5V power rail.
J8 Enables the onboard 7V-12V to 5V LDO to convert the Wide Vin power input on J9 to a +5V power rail
The AM13E230x LaunchPad features a flexible power domain that allows users to supply power to the board in a variety of configurations and power input sources. Table 2-2 shows the different power input configurations and the required shunts that need to be populated or removed to supply power throughout the EVM.
Table 2-2 LP-AM13E230 Power Configurations
Power Source Installed Shunts Description of Power Sources
USB Type-C JP1, JP4
  • +5V0_USB: supplied from the USB-C connector
  • +5V0_XDS110: +5V0_USB passes through JP1 and is the same supply as +5V0_XDS110
  • +5V0_MCU: +5V0_XDS110 passes through JP4 and is the same supply as +5V0_MCU
  • +3V3_XDS110: generated by the XDS-side 5V to 3.3V LDO regulator
  • +3V3_MCU: +3V3_XDS110 passes through JP4 and is the same supply as +3V3_MCU
External +3.3V (connected to BoosterPack header) JP4 +5V0 (optional), J13
  • +5V0_USB: If debugging the device, then connect JP2 +5V0 shunt to provide power to the XDS110 debugger. +5V0_USB is supplied through the USB-C connector and is isolated from the MCU side +5V0 rail. Else if not debugging, +5V0_USB is not required and JP2 +5V0 can be disconnected
  • +5V0_XDS110: Required only if debugging the device. +5V0_MCU passes through JP4 and is the same supply as +5V0_XDS110
  • +5V0_MCU: generated by the 3.3V to 5V BOOST regulator
  • +3V3_XDS110: Required only if debugging the device. +3V3_XDS110 is generated by the XDS-side 5V to 3.3V LDO regulator. Make sure JP4 +3V3 shunt is disconnected to prevent contention on the 3.3V power rail
  • +3V3_MCU: supplied by external +3.3V source
External +5.0V (connected to BoosterPack header) JP4
  • +5V0_USB: If debugging the device, +5V0_USB is supplied through the USB-C connector and is isolated from the MCU side +5V0 rail. Else if not debugging, +5V0_USB is not required.
  • +5V0_XDS110: 5V0_XDS110 passes through JP4 and is the same supply as +5V0_MCU
  • +5V0_MCU: supplied by external +5.0V source
  • +3V3_XDS110: +3V3_XDS110 passes through JP4 and is the same supply as +3V3_MCU
  • +3V3_MCU: generated by the XDS-side 5V to 3.3V LDO regulator
Wide Vin (+7V-12V) J8, JP4
  • +5V0_USB: If debugging the device, +5V0_USB is supplied through the USB-C connector and is isolated from the MCU side +5V0 rail. Else if not debugging, +5V0_USB is not required.
  • +5V0_XDS110: 5V0_XDS110 is supplied by the 7V-12V to 5V LDO
  • +5V0_MCU: +5V0_XDS110 passes through JP4 and is the same supply as +5V0_MCU
  • +3V3_XDS110: generated by the XDS-side 5V to 3.3V LDO regulator
  • +3V3_MCU: +3V3_XDS110 passes through JP4 and is the same supply as +3V3_MCU