SLVUDU7 April   2026 LMG708B0

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
      1. 1.4.1 Application Circuit Diagram
  8. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  9. 3Implementation Results
    1. 3.1 Test Data and Performance Curves
      1. 3.1.1 Efficiency
      2. 3.1.2 Thermal Performance
      3. 3.1.3 Operating Waveforms
        1. 3.1.3.1 Load Transient Response
        2. 3.1.3.2 Start-Up With VIN
        3. 3.1.3.3 Start-Up and Shutdown With ENABLE On and Off
        4. 3.1.3.4 Switching Operation
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 Component Drawings
      2. 4.2.2 Layout Guidelines
        1. 4.2.2.1 Power Stage Layout
        2. 4.2.2.2 Small-signal Component Layout
        3. 4.2.2.3 Thermal Design and Layout
        4. 4.2.2.4 Ground Plane Design
    3. 4.3 Bill of Materials
  11. 5Compliance Information
    1. 5.1 Compliance and Certifications
  12. 6Additional Information
    1. 6.1 Trademarks
  13. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
        1. 7.2.1.1 Low-EMI Design Resources
        2. 7.2.1.2 Thermal Design Resources
        3. 7.2.1.3 PCB Layout Resources

1.3 Specifications

Table 1-1 lists the EVM specifications. VIN = 48V, VOUT = 12V, FSW = 400kHz, unless otherwise indicated.

Table 1-1 Electrical Performance Characteristics
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
INPUT CHARACTERISTICS
Input voltage, VINDC operating244865V
100µs transient 80 V
Input UVLO turn-on threshold, VIN-ONRUV1 = 200kΩ, RUV2 = 10kΩ21V
Input UVLO turn-off threshold, VIN-OFF19
Input supply current, no load, FPWM,
IIN-NL(FPWM)		IOUT = 0A, FPWM/SYNC tied to VCC at header J5VIN = 24V44mA
VIN = 36V51
VIN = 48V48
VIN = 60V46
OUTPUT CHARACTERISTICS
Output voltage, VOUTFixed output setting (or adjustable output setting with 100kΩ and 9.09kΩ feedback divider)(1)11.91212.1V
Output voltage adjustment range, VOUT-ADJWith suitable BOM changes(2)3.315V
Output current, IOUTElectrical design current (EDC)40A
Thermal design current (TDC)(3), airflow = 100LFM(4)30A
Output voltage regulation in FPWM, ΔVOUTLoad regulationIOUT = 0A to 40A4mV
Line regulationVIN = 24V to 65V4
Output voltage ripple, VOUT-ACIOUT = 20A10mVRMS
Output overcurrent protection, IOUT-OCPRS = 1mΩ, IMON tied to GND52A
Output average current limit, IOUT-CCRIMON = 4.32kΩ44A
Soft-start time, tSSVSET pin open circuit2.7ms
Hiccup time, tRES16384 clock cycles41ms
SYSTEM CHARACTERISTICS
Switching frequency, FSWRRT = 54.9kΩ400kHz
Synchronization frequency range, FSYNC320480kHz
Light-load efficiency, ηLIGHT(1)IOUT = 0.1AVIN = 24V94.4%
VIN = 36V 93.8%
VIN = 48V 92.5%
VIN = 60V 91.9%
Half-load efficiency, ηHALF(1) IOUT = 20A VIN = 24V 98.3%
VIN = 36V98%
VIN = 48V97.6%
VIN = 60V97.1%
Full-load efficiency, ηFULL(1)IOUT = 40AVIN = 24V97.5%
VIN = 36V97.2%
VIN = 48V97.0%
VIN = 60V96.7%
LMG708B0 case temperature, TC–40135°C
(1) The default output voltage of this EVM is 12V. Efficiency and other performance metrics can change based on the operating input voltage, load current, ambient temperature, externally-connected output capacitors, and other parameters. Measured with a quick sweep of load current, the efficiency data here includes negligible self-heating effect.
(2) See Table 4-2 and Table 4-3 for BOM changes related to 5V and 3.3V output designs, respectively.
(3) EDC and TDC can differ, for example, when the application requires short-duration transients to a high-current amplitude that does not substantially increase the operating temperatures of the power-stage components.
(4) The recommended airflow is 100LFM when operating at loads above 30A at 25°C ambient temperature. Higher ambient temperatures require increased airflow or heatsinking to keep the case temperature of the GaN converter ICs below 135°C. See Section 3.1.2.