SNAS787C November   2019  – August 2025 CDCDB2000

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable Control
      2. 6.3.2 SMBus
        1. 6.3.2.1 SMBus Address Assignment
      3. 6.3.3 Side-Band Interface
    4. 6.4 Device Functional Modes
      1. 6.4.1 CKPWRGD_PD# Function
      2. 6.4.2 OE[12:5]# and SMBus Output Enables
    5. 6.5 Programming
      1. 6.5.1 SMBus
      2. 6.5.2 SBI
  8. 7 Register Maps
    1. 7.1 CDCDB2000 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Enable Control Method
        2. 8.2.2.2 SMBus Address
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 TICS Pro
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)CDCDB2000UNIT
NPP (GQFN)
80 PINS
RθJAJunction-to-ambient thermal resistance32.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance31.2°C/W
RθJBJunction-to-board thermal resistance15.9°C/W
ΨJTJunction-to-top characterization parameter0.4°C/W
ΨJBJunction-to-board characterization parameter15.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.