SNAS927 August   2025 LMKDB1202 , LMKDB1204

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information 
    5. 6.5 Electrical Characteristics
    6. 6.6 SMBus Timing Requirements
    7. 6.7 SBI Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Features
        1. 8.3.1.1 Running Input Clocks When Device is Powered Off
        2. 8.3.1.2 Fail-Safe Inputs
        3. 8.3.1.3 Input Configurations
          1. 8.3.1.3.1 Internal Termination for Clock Inputs
          2. 8.3.1.3.2 AC-Coupled or DC-Coupled Clock Inputs
      2. 8.3.2 Flexible Power Sequence
        1. 8.3.2.1 PWRDN# Assertion and Deassertion
        2. 8.3.2.2 OE# Assertion and Deassertion
        3. 8.3.2.3 Clock Input and PWRGD/PWRDN# Behaviors When Device Power is Off
      3. 8.3.3 LOS and OE
        1. 8.3.3.1 Synchronous OE
        2. 8.3.3.2 OE Control
          1. 8.3.3.2.1 OE Mapping
        3. 8.3.3.3 Automatic Output Disable
        4. 8.3.3.4 LOS Detection
      4. 8.3.4 Output Features
        1. 8.3.4.1 Output Banks
        2. 8.3.4.2 Double Termination
        3. 8.3.4.3 Programmable Output Slew Rate
          1. 8.3.4.3.1 Slew Rate Control Through SMBus
        4. 8.3.4.4 Programmable Output Swing
        5. 8.3.4.5 Accurate Output Impedance
        6. 8.3.4.6 Programmable Output Impedance
    4. 8.4 Device Functional Modes
      1. 8.4.1 SMBus Mode
      2. 8.4.2 SBI Mode
      3. 8.4.3 Pin Mode
  10. Register Maps
    1. 9.1 LMKDB12xx Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

SMBus Mode

In SMBus mode, LMKDB11xx device SMBus registers can be written and read through SMBus pins. Pin SADR1 and SADR0 set the SMBus address.

SADR1SADR08-Bit SMBus Address (R/W Bit = 0)
LowLow0xD8
LowFloat0xDA
LowHigh0xDE
FloatLow0xC2
FloatFloat0xC4
FloatHigh0xC6
HighLow0xCA
HighFloat0xCC
HighHigh0xCE

Table 8-7 Command Code Definition
BITDESCRIPTION
70 = Block Read or Block Write operation
1 = Byte Read or Byte Write operation
(6:0)Register address for Byte operations, or starting register address for Block, operations
LMKDB1202 LMKDB1204 Generic
          Programming SequenceFigure 8-6 Generic Programming Sequence
LMKDB1202 LMKDB1204 Byte Write
          ProtocolFigure 8-7 Byte Write Protocol
LMKDB1202 LMKDB1204 Byte Read
          ProtocolFigure 8-8 Byte Read Protocol
LMKDB1202 LMKDB1204 Block Write
          ProtocolFigure 8-9 Block Write Protocol
LMKDB1202 LMKDB1204 Block Read
          ProtocolFigure 8-10 Block Read Protocol