SNLS783A May   2025  – October 2025 DP83826AE , DP83826AI

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Mode Comparison Tables
  6. 5 Pin Configuration and Functions (ENHANCED Mode)
  7. 6 Pin Configuration and Functions (BASIC Mode)
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Auto-Negotiation (Speed/Duplex Selection)
      2. 8.3.2  Auto-MDIX Resolution
      3. 8.3.3  Energy Efficient Ethernet
        1. 8.3.3.1 EEE Overview
        2. 8.3.3.2 EEE Negotiation
      4. 8.3.4  EEE for Legacy MACs Not Supporting 802.3az
      5. 8.3.5  Wake-on-LAN Packet Detection
        1. 8.3.5.1 Magic Packet Structure
        2. 8.3.5.2 Magic Packet Example
        3. 8.3.5.3 Wake-on-LAN Configuration and Status
      6. 8.3.6  Low Power Modes
        1. 8.3.6.1 Active Sleep
        2. 8.3.6.2 IEEE Power-Down
        3. 8.3.6.3 Deep Power Down State
      7. 8.3.7  Clock Output
      8. 8.3.8  Media Independent Interface (MII)
      9. 8.3.9  Reduced Media Independent Interface (RMII)
      10. 8.3.10 RMII Repeater Mode
      11. 8.3.11 Serial Management Interface
        1. 8.3.11.1 Extended Register Space Access
        2. 8.3.11.2 Write Address Operation
        3. 8.3.11.3 Read Address Operation
        4. 8.3.11.4 Write (No Post Increment) Operation
        5. 8.3.11.5 Read (No Post Increment) Operation
        6. 8.3.11.6 Example Write Operation (No Post Increment)
      12. 8.3.12 100BASE-TX
        1. 8.3.12.1 100BASE-TX Transmitter
          1. 8.3.12.1.1 Code-Group Encoding and Injection
          2. 8.3.12.1.2 Scrambler
          3. 8.3.12.1.3 NRZ to NRZI Encoder
          4. 8.3.12.1.4 Binary to MLT-3 Converter
        2. 8.3.12.2 100BASE-TX Receiver
      13. 8.3.13 10BASE-Te
        1. 8.3.13.1 Squelch
        2. 8.3.13.2 Normal Link Pulse Detection and Generation
        3. 8.3.13.3 Jabber
        4. 8.3.13.4 Active Link Polarity Detection and Correction
      14. 8.3.14 Loopback Modes
        1. 8.3.14.1 Near-end Loopback
        2. 8.3.14.2 MII Loopback
        3. 8.3.14.3 PCS Loopback
        4. 8.3.14.4 Digital Loopback
        5. 8.3.14.5 Analog Loopback
        6. 8.3.14.6 Far-End (Reverse) Loopback
      15. 8.3.15 BIST Configurations
      16. 8.3.16 Cable Diagnostics
        1. 8.3.16.1 Time Domain Reflectometry (TDR)
      17. 8.3.17 Fast Link-Drop Functionality
      18. 8.3.18 LED and GPIO Configuration
    4. 8.4 Programming
      1. 8.4.1 Hardware Bootstraps Configuration
        1. 8.4.1.1 Bootstrap Configurations (ENHANCED Mode)
        2. 8.4.1.2 Strap Configuration (BASIC Mode)
    5. 8.5 Register Maps
      1. 8.5.1 DP83826A Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Twisted-Pair Interface (TPI) Network Circuit
      2. 9.2.2 Transformer Recommendations
      3. 9.2.3 Capacitive DC Blocking
      4. 9.2.4 Design Requirements
        1. 9.2.4.1 Clock Requirements
          1. 9.2.4.1.1 Oscillator
          2. 9.2.4.1.2 Crystal
      5. 9.2.5 Detailed Design Procedure
        1. 9.2.5.1 MII Layout Guidelines
        2. 9.2.5.2 RMII Layout Guidelines
        3. 9.2.5.3 MDI Layout Guidelines
      6. 9.2.6 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Transformer Layout
        4. 9.4.1.4 Metal Pour
        5. 9.4.1.5 PCB Layer Stacking
          1. 9.4.1.5.1 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

11 Revision History

Changes from Revision * (May 2025) to Revision A (October 2025)

  • Updated the VOL_3V3 from max of 0.8V to max of 0.4VGo
  • Updated 100M MII Receive TimingGo
  • Updated the 25MHz and 50MHz clock frequency tolerance from ±100ppm to ±50ppmGo
  • Updated the junction temperature from 115°C to 125°CGo
  • Added RMII Repater Mode sectionGo
  • Changed Strap 8 condition from X to LOW for option #2 and #6Go
  • Updated the flow chart to add Strap 11 configurationGo
  • Updated Table 8-8 to reflect the default bootstrap settingGo
  • Changed PHY_ADD0 = 1 from PHY_ADD0 = 0 in BASIC Mode PHY Address Strap table when Mode = 1.Go
  • Updated register 0x1E bit 14 descriptionGo
  • Changed from slave to follower in Table 8-92 Bit 3Go
  • Deleted Table 9-1 recommend transformers since they are obseleteGo
  • Updated the clock frequency ppm from ±100ppm to ±50ppmGo