SNVA951 November   2020 LM61460-Q1 , LM63615-Q1 , LM63625-Q1 , LM63635-Q1 , LMR33620-Q1 , LMR33630-Q1

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 The Goal of Thermal Management
  4. 3 Junction Temperature Calculation
    1. 3.1 Regulator Junction Temperature (TJ)
    2. 3.2 Ambient Temperature (TA)
    3. 3.3 Power Dissipation (PD)
    4. 3.4 Thermal Resistance (θJA)
      1. 3.4.1 Thermal Metrics
  5. 4 Package Type
  6. 5 PCB Copper Heat Sink
  7. 6 PCB Layout Tips
  8. 7 Estimating and Measuring θJA
    1. 7.1 Simple Guideline
    2. 7.2 Data Sheet Curves
    3. 7.3 Simplified Heat Flow Spreadsheet
    4. 7.4 Online Database
    5. 7.5 Thermal Simulators
  9. 8 Measuring Thermal Performance
    1. 8.1 Thermal Camera
    2. 8.2 Thermocouple
    3. 8.3 Internal Diode
  10. 9 Thermal Design Example
  11. 10Conclusion
  12. 11References

2 The Goal of Thermal Management

The goal of thermal management is to keep the maximum junction temperature of the device at or below a safe value. This safe value is stated in the data sheet under the "Absolute Maximum" specification section as shown in the example of Figure 2-1.

GUID-D0A26B0C-50F7-410F-9C44-11532C44ED58-low.gif Figure 2-1 Maximum Junction Temperature Specification

This will usually be 125°C or 150°C for an automotive qualified device and is called TJ-max. A good thermal design will keep the converter temperature below this value under all operating conditions.