SNVSAF7C August   2016  – October 2025 LM27762

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout
      2. 6.3.2 Input Current Limit
      3. 6.3.3 PFM Operation
      4. 6.3.4 Output Discharge
      5. 6.3.5 Power-Good Output (PGOOD)
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Enable Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Positive Low-Dropout Linear Regulator and OUT+ Voltage Setting
        2. 7.2.2.2 Charge-Pump Voltage Inverter
        3. 7.2.2.3 Negative Low-Dropout Linear Regulator and OUT– Voltage Setting
        4. 7.2.2.4 External Capacitor Selection
          1. 7.2.2.4.1 Charge-Pump Output Capacitor
          2. 7.2.2.4.2 Input Capacitor
          3. 7.2.2.4.3 Flying Capacitor
          4. 7.2.2.4.4 LDO Output Capacitor
        5. 7.2.2.5 Power Dissipation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)LM27762UNIT
DSS (WSON)
12 PINS
RθJAJunction-to-ambient thermal resistance62.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance54.7°C/W
RθJBJunction-to-board thermal resistance25.6°C/W
ψJTJunction-to-top characterization parameter1.8°C/W
ψJBJunction-to-board characterization parameter25.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.