SNVSAF7C August   2016  – October 2025 LM27762

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout
      2. 6.3.2 Input Current Limit
      3. 6.3.3 PFM Operation
      4. 6.3.4 Output Discharge
      5. 6.3.5 Power-Good Output (PGOOD)
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Enable Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Positive Low-Dropout Linear Regulator and OUT+ Voltage Setting
        2. 7.2.2.2 Charge-Pump Voltage Inverter
        3. 7.2.2.3 Negative Low-Dropout Linear Regulator and OUT– Voltage Setting
        4. 7.2.2.4 External Capacitor Selection
          1. 7.2.2.4.1 Charge-Pump Output Capacitor
          2. 7.2.2.4.2 Input Capacitor
          3. 7.2.2.4.3 Flying Capacitor
          4. 7.2.2.4.4 LDO Output Capacitor
        5. 7.2.2.5 Power Dissipation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
VIN to GND or GND to VOUT5.8V
EN+, EN- GND − 0.3VINV
CPOUT, OUT+ and OUT- , continuous output current300mA
OUT+, OUT- short-circuit duration to GND(3)1s
Continuous power dissipation(4)Internally limited
TJMAX(4)150°C
Operating input voltage, VIN2.75.5V
Operating output current, IOUT0250mA
Operating ambient temperature, TA–4085°C
Operating junction temperature, TJ–40125°C
Storage temperature, Tstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(3) OUT may be shorted to GND for one second without damage. However, shorting OUT to VIN may damage the device and must be avoided. Also, for temperatures above TA = 85°C, VOUT must not be shorted to GND or VIN or device may be damaged.
(4) Internal thermal shutdown circuitry protects the device from damage.