SNVU943 April   2025 TPSM33620-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Setup
    2. 2.2 Jumper Information
    3. 2.3 Test Points
  8. 3Implementation Results
    1. 3.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks

3.2 Performance Data and Results

TPSM33620QEVM Thermal Capture, 13.5VIN, 3.3VOUT, 2.2MHz, 2A Figure 3-1 Thermal Capture, 13.5VIN, 3.3VOUT, 2.2MHz, 2A
TPSM33620QEVM Thermal Capture, 36VIN, 3.3VOUT, 2.2MHz, 2A Figure 3-2 Thermal Capture, 36VIN, 3.3VOUT, 2.2MHz, 2A
TPSM33620QEVM TPSM33620QEVM Conducted EMI Results, 13.5VIN, 3.3VOUT, 2A (Green-Average Scan, Purple-Peak Scan) Figure 3-3 TPSM33620QEVM Conducted EMI Results, 13.5VIN, 3.3VOUT, 2A (Green-Average Scan, Purple-Peak Scan)