SNVU943 April   2025 TPSM33620-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Setup
    2. 2.2 Jumper Information
    3. 2.3 Test Points
  8. 3Implementation Results
    1. 3.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks

4.2 PCB Layouts

TPSM33620QEVM Top View of EVM Figure 4-4 Top View of EVM
TPSM33620QEVM EVM Top Copper Layer Figure 4-5 EVM Top Copper Layer
TPSM33620QEVM Mid-Layer One Figure 4-6 Mid-Layer One
TPSM33620QEVM Mid-Layer Two Figure 4-7 Mid-Layer Two
TPSM33620QEVM EVM Bottom Copper Layer Figure 4-8 EVM Bottom Copper Layer
TPSM33620QEVM Bottom View of EVM Figure 4-9 Bottom View of EVM