SPRAD05E August   2024  – October 2025 AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Before Getting Started With the Custom Board Design
    2. 1.2 Processor-Specific SDK
    3. 1.3 Peripheral Circuit Implementation - Compatibility Between Processor Families
    4. 1.4 Selection of Required Processor OPN (Orderable Part Number)
      1. 1.4.1 Processor Support for Secure Boot and Functional Safety
      2. 1.4.2 Note on AM625SIP Processor Data Sheet
      3. 1.4.3 AM625 and AM625SIP Custom Boards, Design Compatibility
    5. 1.5 Technical Documentation
      1. 1.5.1 Updated SK Schematic With Design, Review and Cad Notes Added
      2. 1.5.2 Collaterals on TI.com, Processor Product Page
      3. 1.5.3 Schematic Design Guidelines and Schematic Review Checklist - Processor Family Specific User's Guide
      4. 1.5.4 Updates to Hardware Design Considerations User's Guide
      5. 1.5.5 Processor and Peripherals Related FAQs to Support Custom Board Designs
    6. 1.6 Custom Board Design Documentation
    7. 1.7 Processor and Processor Peripherals Design Related Queries During Custom Board Design
  5. 2 Custom Board Design Block Diagram
    1. 2.1 Developing the Custom Board Design Block Diagram
    2. 2.2 Configuring the Boot Mode
    3. 2.3 Configuring the Processor Pins Functionality (PinMux Configuration)
  6. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power Architecture
      2. 3.1.2 Discrete Power Architecture
    2. 3.2 Processor Supply (Power) Rails (Operating Voltage)
      1. 3.2.1 Supported Low-Power Modes
        1. 3.2.1.1 Partial IO Support for CAN/GPIO/UART Wakeup
      2. 3.2.2 Core Power Supply
      3. 3.2.3 Peripherals Power Supply
      4. 3.2.4 DDR PHY and SDRAM Power Supply
        1. 3.2.4.1 AM625 / AM623 / AM620-Q1 / AM625-Q1
        2. 3.2.4.2 AM625SIP
      5. 3.2.5 Dual-Voltage IO Supply for IO Group (Processor) Power Supply
      6. 3.2.6 Dynamic Voltage Switching Dual-Voltage Power Supply
      7. 3.2.7 VPP (eFuse ROM Programming) Power Supply
      8. 3.2.8 Internal LDOs for IO Supply for IO Groups (Processor)
    3. 3.3 Power Supply Filtering
    4. 3.4 Power Supply Decoupling and Bulk Capacitors
      1. 3.4.1 AM625 / AM623 / AM620-Q1 / AM625-Q1
      2. 3.4.2 AM625SIP
      3. 3.4.3 Note on PDN Target Impedance
    5. 3.5 Power Supply Sequencing
    6. 3.6 Power Supply Diagnostics (Using Processor Supported External Input Voltage Monitors)
    7. 3.7 Power Supply Diagnostics (Monitoring Using External Monitoring Circuit (Devices))
    8. 3.8 Custom Board Current Requirements Estimation and Supply Sizing
  7. 4 Processor Clock (Input and Output)
    1. 4.1 Processor Clocking (External Crystal or External Oscillator)
      1. 4.1.1 WKUP_LFOSC0 Connection When Unused
      2. 4.1.2 MCU_OSC0 and WKUP_LFOSC0, Crystal Selection
      3. 4.1.3 LVCMOS Compatible Digital Clock Input Source
    2. 4.2 Processor Clock Outputs
      1. 4.2.1 Observation Clock Outputs
    3. 4.3 Clock Tree Tool
  8. 5 JTAG (Joint Test Action Group)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 BSDL File
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 Connection Recommendations for JTAG Interface Signals
      4. 5.1.4 Debug Boot Modes and Boundary Scan Compliance
  9. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
    2. 6.2 Latching of Processor Boot Mode Configuration Inputs
    3. 6.3 Resetting of the Attached Device
    4. 6.4 Watchdog Timer
  10. 7 Processor - Peripherals Connection
    1. 7.1  Supported Processor Cores and MCU Cores
    2. 7.2  Selecting Peripherals Across Domains
    3. 7.3  Memory Controller (DDRSS)
      1. 7.3.1 AM625 / AM623 / AM620-Q1 / AM625-Q1
        1. 7.3.1.1 Processor DDR Subsystem and Device Register Configuration
        2. 7.3.1.2 Calibration Resistor Connection for DDRSS
        3. 7.3.1.3 DDRSS Signals Pin (Package) Delay Information
        4. 7.3.1.4 Attached Memory Device ZQ and Reset_N (Memory Device Reset) Connection
      2. 7.3.2 AM625SIP
        1. 7.3.2.1 AMK Package Reassigned DDRSS Pins
        2. 7.3.2.2 DDRSS and Memory Device Calibration Resistor Connection
        3. 7.3.2.3 LPDDR4 (Internal) Memory Calibration Resistor Connection
    4. 7.4  Media and Data Storage Interfaces (MMC0, MMC1, MMC2, OSPI0/QSPI0 and GPMC0)
    5. 7.5  Ethernet Interface
      1. 7.5.1 Common Platform Ethernet Switch 3-port Gigabit (CPSW3G0)
    6. 7.6  Programmable Real-Time Unit Subsystem (PRUSS)
    7. 7.7  Universal Serial Bus (USB) Subsystem
    8. 7.8  General Connectivity Peripherals
      1. 7.8.1 Inter-Integrated Circuit (I2C) Interface
    9. 7.9  Display Subsystem (DSS)
      1. 7.9.1 AM625 / AM623 / AM625-Q1 / AM625SIP
      2. 7.9.2 AM620-Q1
    10. 7.10 CSI-Rx (Camera Serial interface)
    11. 7.11 Real-Time Clock (RTC) Module
    12. 7.12 Connection of Processor Power Supply Pins, IOs and Peripherals When not Used
      1. 7.12.1 AM625 / AM623 / AM620-Q1 / AM625-Q1
      2. 7.12.2 AM625SIP
      3. 7.12.3 External Interrupt (EXTINTn)
      4. 7.12.4 RSVD Reserved Pins (Signals)
    13. 7.13 SK Specific Circuit Implementation (Reuse)
  11. 8 Interfacing of Processor IOs (LVCMOS or SDIO or Open-Drain, Fail-Safe Type IO Buffers) and Performing Simulations
    1. 8.1 IBIS Model
    2. 8.2 IBIS-AMI Model
  12. 9 Processor Current Draw and Thermal Analysis
    1. 9.1 Power Estimation
    2. 9.2 Maximum Current Rating for Different Supply Rails
    3. 9.3 Supported Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 Thermal Model
      2. 9.4.2 Voltage Thermal Management Module (VTM)
  13. 10Schematic:- Capture, Entry and Review
    1. 10.1 Custom Board Design Passive Components and Values Selection
    2. 10.2 Custom Board Design Electronic Computer Aided Design (ECAD) Tools Considerations
    3. 10.3 Custom Board Design Schematic Capture
    4. 10.4 Custom Board Design Schematic Review
  14. 11Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 DDR Design and Layout Guidelines
      1. 11.2.1 AM625 / AM623 / AM620-Q1 / AM625-Q1
      2. 11.2.2 AM625SIP
    3. 11.3 High-Speed Differential Signal Routing Guidelines
    4. 11.4 Processor-Specific SK Board Layout
    5. 11.5 Custom Board Layer Count and Layer Stack-up
      1. 11.5.1 AM625 / AM623 / AM620-Q1 / AM625-Q1
      2. 11.5.2 AM625SIP
      3. 11.5.3 Simulation Recommendations
    6. 11.6 DDR-MARGIN-FW
    7. 11.7 Reference for Steps to be Followed for Running Board Simulation
    8. 11.8 Software Development Training (Academy) for Processors
  15. 12Custom Board Assembly and Testing
    1. 12.1 Custom Board Bring-up Tips and Debug Guidelines
  16. 13Processor (Device) Handling and Assembly
    1. 13.1 Processor (Device) Soldering Recommendations
      1. 13.1.1 Additional References
  17. 14References
    1. 14.1 AM625SIP
    2. 14.2 AM625 / AM623
    3. 14.3 AM620-Q1 / AM625-Q1
    4. 14.4 AM625 / AM623 / AM620-Q1 / AM625-Q1
    5. 14.5 Common for all AM62x family of processors
  18. 15Terminology
  19. 16Revision History

15 Terminology

    BSDL Boundary-Scan Description Language
    CAN-FD Controller Area Network Flexible Data-Rate
    CPPI Communications Port Programming Interface
    CPSW3G Common Platform Ethernet Switch 3-port Gigabit
    CSIRX Camera Streaming Interface Receiver
    DPI Display Parallel Interface
    DRD Dual-Role Device
    E2E Engineer to Engineer
    ECAD Electronic Computer Aided Design
    ECAP enhanced Capture
    ECC Error-Correcting Code
    eMMC embedded Multi-Media Card
    EMU Emulation Control
    EPWM enhanced Pulse-Width Modulator
    EQEP enhanced Quadrature Encoder Pulse
    GEMAC Gigabit Ethernet Media Access Controller
    GPIO General Purpose Input/Output
    GPMC General-Purpose Memory Controller
    HS-RTDX High-Speed Real Time Data eXchange
    I2C Inter-Integrated Circuit
    IBIS Input/Output Buffer Information Specification
    IEP Industrial Ethernet Peripheral
    JTAG Joint Test Action Group
    LDO Low-Dropout
    LVCMOS Low Voltage Complementary Metal Oxide Semiconductor
    LVDS Low Voltage Differential Signaling
    MCAN Modular Controller Area Network
    MCASP Multichannel Audio Serial Ports
    MCU Micro Controller Unit
    MMC Multi-Media Card
    MSL Moisture Sensitivity Level
    NVM Non Volatile Memory
    OLDI Open LVDS Display Interface
    OSPI Octal Serial Peripheral Interface
    OTP One-Time Programmable
    PCB Printed Circuit Board
    PDN Power Distribution Network
    PMIC Power Management Integrated Circuit
    POR Power-on Reset
    PRUSS Programmable Real-Time Unit Subsystem
    QSPI Quad Serial Peripheral Interface
    RGMII Reduced Gigabit Media Independent Interface
    RMII Reduced Media Independent Interface
    SD Secure Digital
    SDIO Secure Digital Input Output
    SDK Software Development Kit
    SPI Serial Peripheral Interface
    TCK Test Clock Input
    TDI Test Data Input
    TDO Test Data Output
    TMS Test Mode Select Input
    TRM Technical Reference Manual
    TRSTn Test Reset
    UART Universal Asynchronous Receiver/Transmitter
    USB Universal Serial Bus
    VCA Via Channel Array
    WKUP Wakeup
    XDS eXtended Development System