SWRS306D October   2024  – December 2025 CC2755P10 , CC2755R10

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RHA package
      2. 6.1.2 Pin Diagram—YCJ package
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions—RHA Package
      2. 6.2.2 Signal Descriptions—YCJ Package
    3. 6.3 Connections for Unused Pins and Modules
      1. 6.3.1 Connections for Unused Pins and Modules—RHA Package
      2. 6.3.2 Connections for Unused Pins and Modules—YCJ Package
    4. 6.4 Peripheral Pin Mapping
      1. 6.4.1 RHA Peripheral Pin Mapping
      2. 6.4.2 YCJ Peripheral Pin Mapping
    5. 6.5 Peripheral Signal Descriptions
      1. 6.5.1 RHA Peripheral Signal Descriptions
      2. 6.5.2 YCJ Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes (R variant)
    11. 7.11 Power Consumption–Radio Modes (P variant)
    12. 7.12 Nonvolatile (Flash) Memory Characteristics
    13. 7.13 Thermal Resistance Characteristics
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy—Receive (RX)
    16. 7.16 Bluetooth Low Energy—Transmit (TX)
    17. 7.17 Bluetooth Channel Sounding
    18. 7.18 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    19. 7.19 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    20. 7.20 2.4GHz RX/TX CW
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Reset Timing
      2. 7.21.2 Wakeup Timing
      3. 7.21.3 Clock Specifications
        1. 7.21.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.21.3.2 96MHz RC Oscillator (HFOSC)
        3. 7.21.3.3 80/90/98MHz RC Oscillator (AFOSC)
        4. 7.21.3.4 32kHz Crystal Oscillator (LFXT)
        5. 7.21.3.5 32kHz RC Oscillator (LFOSC)
    22. 7.22 Peripheral Characteristics
      1. 7.22.1 UART
        1. 7.22.1.1 UART Characteristics
      2. 7.22.2 SPI
        1. 7.22.2.1 SPI Characteristics
        2. 7.22.2.2 SPI Controller Mode
        3. 7.22.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.22.2.4 SPI Peripheral Mode
        5. 7.22.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.22.3 I2C
        1. 7.22.3.1 I2C Characteristics
        2. 7.22.3.2 I2C Timing Diagram
      4. 7.22.4 I2S
        1. 7.22.4.1 I2S Controller Mode
        2. 7.22.4.2 I2S Peripheral Mode
      5. 7.22.5 GPIO
        1. 7.22.5.1 GPIO DC Characteristics
      6. 7.22.6 ADC
        1. 7.22.6.1 Analog-to-Digital Converter (ADC) Characteristics
      7. 7.22.7 Comparators
        1. 7.22.7.1 Low power comparator
      8. 7.22.8 Voltage Glitch Monitor
    23. 7.23 Typical Characteristics
      1. 7.23.1 MCU Current
      2. 7.23.2 RX Current
      3. 7.23.3 TX Current
      4. 7.23.4 RX Performance
      5. 7.23.5 TX Performance
      6. 7.23.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread, Zigbee, Matter)
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.2.2 Signal Descriptions—YCJ Package

Table 6-4 Signal Descriptions—YCJ Package Preview
PIN I/O TYPE DESCRIPTION
NAME NO.
VDDR C8 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(1)(2)(3)
VDDR A2 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(1)(2)(3)
DIO0 D7 I/O Digital GPIO
DIO1 D6 I/O Digital GPIO
DIO2 E8 I/O Digital GPIO, high-drive capability
DIO3 E7 I/O Digital GPIO, high-drive capability
DIO4 F6 I/O Digital GPIO
DIO5 F7 I/O Digital GPIO
DIO6 G7 I/O Digital GPIO
VDDIO F8 — Power 1.71V to 3.63V split rail I/O supply
DIO7 G8 I/O Digital GPIO
DIO8 H8 I/O Digital GPIO
DIO9_SWDIO H7 I/O Digital GPIO, SWD interface: mode select or SWDIO, high-drive capability
DIO10_SWDCK H6 I/O Digital GPIO, SWD interface: clock, high-drive capability
DIO11 G6 I/O Digital GPIO, high-drive capability
DIO12 F5 I/O Digital GPIO, high-drive capability
DIO13 G5 I/O Digital GPIO
DIO14 H5 I/O Digital GPIO
DIO15 F4 I/O Digital GPIO
DIO16 G4 I/O Digital GPIO
VDDIO H4 — Power 1.71V to 3.63V split rail I/O supply
VDDS H3 — Power 1.71V to 3.63V supply
VDDS G1 — Power 1.71V to 3.63V supply
DIO17_A8 G3 I/O Digital or Analog GPIO, analog capability, high-drive capability
DIO18_A7 F3 I/O Digital or Analog GPIO, analog capability, high-drive capability
DIO19_A6 H2 I/O Digital or Analog GPIO, analog capability
DIO20_A5 G2 I/O Digital or Analog GPIO, analog capability
DIO21_A4 F2 I/O Digital or Analog GPIO, analog capability
DIO22_A3 E2 I/O Digital or Analog GPIO, analog capability
RSTN H1 I Digital Reset, active low. No internal pullup resistor
DIO23_X32P F1 I/O Digital or Analog GPIO, 32kHz crystal oscillator pin 1, Optional TCXO input
DIO24_X32N E1 I/O Digital or Analog GPIO, 32kHz crystal oscillator pin 2
DIO25_A2 D3 I/O Digital GPIO
DIO26 D2 I/O Digital GPIO
DIO29_A10 B4 I/O Digital GPIO
DIO30_A9 B5 I/O Digital GPIO
VDDD D1 — Power For decoupling of internal 1.28V regulated core-supply. Connect an external 1μF decoupling capacitor.(1)
VDDS C1 — Power 1.71V to 3.63V supply. Connect an external 10μF decoupling capacitor.
DCDC_SW B1 — Power Switching node of internal DC/DC converter
VDDS A1 — Power 1.71V to 3.63V supply
VDDS A3 — Power 1.71V to 3.63V supply
DIO27_A1 B2 I/O Digital or Analog GPIO, analog capability
DIO28_A0 B3 I/O Digital or Analog GPIO, analog capability
VDDR A2 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO. Connect an external 10μF decoupling capacitor.(1)(2)(3)
X48P A4 — Analog 48MHz crystal oscillator pin 1
X48N A5 — Analog 48MHz crystal oscillator pin 2
VDDS A6 — Power 1.71V to 3.63V supply
ANT A7 I/O RF 2.4GHz TX, RX
GND E3 — GND Ground
GND E4 — GND Ground
GND E5 — GND Ground
GND E6 — GND Ground
GND D4 — GND Ground
GND D5 — GND Ground
GND D8 — GND Ground
GND C2 — GND Ground
GND C3 — GND Ground
GND C4 — GND Ground
GND C5 — GND Ground
GND C6 — GND Ground
GND C7 — GND Ground
GND B6 — GND Ground
GND B7 — GND Ground
(1) Do not supply external circuitry from this pin.
(1) VDDR pins must be tied together on the PCB.
(2) Output from internal DC/DC and LDO is trimmed to 1.5V.
(3) For more details, see the technical reference manual listed in Documentation Support.