SWRS306D October   2024  – December 2025 CC2755P10 , CC2755R10

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RHA package
      2. 6.1.2 Pin Diagram—YCJ package
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions—RHA Package
      2. 6.2.2 Signal Descriptions—YCJ Package
    3. 6.3 Connections for Unused Pins and Modules
      1. 6.3.1 Connections for Unused Pins and Modules—RHA Package
      2. 6.3.2 Connections for Unused Pins and Modules—YCJ Package
    4. 6.4 Peripheral Pin Mapping
      1. 6.4.1 RHA Peripheral Pin Mapping
      2. 6.4.2 YCJ Peripheral Pin Mapping
    5. 6.5 Peripheral Signal Descriptions
      1. 6.5.1 RHA Peripheral Signal Descriptions
      2. 6.5.2 YCJ Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes (R variant)
    11. 7.11 Power Consumption–Radio Modes (P variant)
    12. 7.12 Nonvolatile (Flash) Memory Characteristics
    13. 7.13 Thermal Resistance Characteristics
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy—Receive (RX)
    16. 7.16 Bluetooth Low Energy—Transmit (TX)
    17. 7.17 Bluetooth Channel Sounding
    18. 7.18 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    19. 7.19 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    20. 7.20 2.4GHz RX/TX CW
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Reset Timing
      2. 7.21.2 Wakeup Timing
      3. 7.21.3 Clock Specifications
        1. 7.21.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.21.3.2 96MHz RC Oscillator (HFOSC)
        3. 7.21.3.3 80/90/98MHz RC Oscillator (AFOSC)
        4. 7.21.3.4 32kHz Crystal Oscillator (LFXT)
        5. 7.21.3.5 32kHz RC Oscillator (LFOSC)
    22. 7.22 Peripheral Characteristics
      1. 7.22.1 UART
        1. 7.22.1.1 UART Characteristics
      2. 7.22.2 SPI
        1. 7.22.2.1 SPI Characteristics
        2. 7.22.2.2 SPI Controller Mode
        3. 7.22.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.22.2.4 SPI Peripheral Mode
        5. 7.22.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.22.3 I2C
        1. 7.22.3.1 I2C Characteristics
        2. 7.22.3.2 I2C Timing Diagram
      4. 7.22.4 I2S
        1. 7.22.4.1 I2S Controller Mode
        2. 7.22.4.2 I2S Peripheral Mode
      5. 7.22.5 GPIO
        1. 7.22.5.1 GPIO DC Characteristics
      6. 7.22.6 ADC
        1. 7.22.6.1 Analog-to-Digital Converter (ADC) Characteristics
      7. 7.22.7 Comparators
        1. 7.22.7.1 Low power comparator
      8. 7.22.8 Voltage Glitch Monitor
    23. 7.23 Typical Characteristics
      1. 7.23.1 MCU Current
      2. 7.23.2 RX Current
      3. 7.23.3 TX Current
      4. 7.23.4 RX Performance
      5. 7.23.5 TX Performance
      6. 7.23.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread, Zigbee, Matter)
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.13 Thermal Resistance Characteristics

THERMAL METRIC THERMAL METRIC PACKAGE UNIT(1)
RKP
(VQFN)		 WCSP
40 PINS 62 PINS
RθJA Junction-to-ambient thermal resistance 26.4 TBD ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 14.7 TBD ℃/W
RθJB Junction-to-board thermal resistance 8.1 TBD ℃/W
ψJT Junction-to-top characterization parameter 0.2 TBD ℃/W
ψJB Junction-to-board characterization parameter 8.1 TBD ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.6 TBD ℃/W
(1) °C/W = degrees Celsius per watt