SWRS306D October   2024  – December 2025 CC2755P10 , CC2755R10

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RHA package
      2. 6.1.2 Pin Diagram—YCJ package
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions—RHA Package
      2. 6.2.2 Signal Descriptions—YCJ Package
    3. 6.3 Connections for Unused Pins and Modules
      1. 6.3.1 Connections for Unused Pins and Modules—RHA Package
      2. 6.3.2 Connections for Unused Pins and Modules—YCJ Package
    4. 6.4 Peripheral Pin Mapping
      1. 6.4.1 RHA Peripheral Pin Mapping
      2. 6.4.2 YCJ Peripheral Pin Mapping
    5. 6.5 Peripheral Signal Descriptions
      1. 6.5.1 RHA Peripheral Signal Descriptions
      2. 6.5.2 YCJ Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes (R variant)
    11. 7.11 Power Consumption–Radio Modes (P variant)
    12. 7.12 Nonvolatile (Flash) Memory Characteristics
    13. 7.13 Thermal Resistance Characteristics
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy—Receive (RX)
    16. 7.16 Bluetooth Low Energy—Transmit (TX)
    17. 7.17 Bluetooth Channel Sounding
    18. 7.18 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    19. 7.19 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    20. 7.20 2.4GHz RX/TX CW
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Reset Timing
      2. 7.21.2 Wakeup Timing
      3. 7.21.3 Clock Specifications
        1. 7.21.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.21.3.2 96MHz RC Oscillator (HFOSC)
        3. 7.21.3.3 80/90/98MHz RC Oscillator (AFOSC)
        4. 7.21.3.4 32kHz Crystal Oscillator (LFXT)
        5. 7.21.3.5 32kHz RC Oscillator (LFOSC)
    22. 7.22 Peripheral Characteristics
      1. 7.22.1 UART
        1. 7.22.1.1 UART Characteristics
      2. 7.22.2 SPI
        1. 7.22.2.1 SPI Characteristics
        2. 7.22.2.2 SPI Controller Mode
        3. 7.22.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.22.2.4 SPI Peripheral Mode
        5. 7.22.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.22.3 I2C
        1. 7.22.3.1 I2C Characteristics
        2. 7.22.3.2 I2C Timing Diagram
      4. 7.22.4 I2S
        1. 7.22.4.1 I2S Controller Mode
        2. 7.22.4.2 I2S Peripheral Mode
      5. 7.22.5 GPIO
        1. 7.22.5.1 GPIO DC Characteristics
      6. 7.22.6 ADC
        1. 7.22.6.1 Analog-to-Digital Converter (ADC) Characteristics
      7. 7.22.7 Comparators
        1. 7.22.7.1 Low power comparator
      8. 7.22.8 Voltage Glitch Monitor
    23. 7.23 Typical Characteristics
      1. 7.23.1 MCU Current
      2. 7.23.2 RX Current
      3. 7.23.3 TX Current
      4. 7.23.4 RX Performance
      5. 7.23.5 TX Performance
      6. 7.23.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread, Zigbee, Matter)
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

3 Description

The SimpleLink™ CC2755R and CC2755P family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth® Low Energy (6.x and the upcoming versions), Zigbee (3.0 and the upcoming versions), Thread (1.3 and the upcoming versions), Matter (1.2 and the upcoming versions), and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), appliances, asset tracking, medical, and personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for features in Bluetooth® 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth® Low Energy specifications
  • Bluetooth® Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • Arm®Custom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth® software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Zigbee® protocol stack support in the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Matter stack support in SIMPLELINK MATTER SDK
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm® Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth® Low Energy

The CC2755R and CC2755P devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

Device Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
CC2755R105E0WRHARQFN406.0mm × 6.0mm
CC2755R105E0YCJR(3)WCSP3.5mm × 3.4mm
CC2755P105E0WRHARQFN406.0mm × 6.0mm
(1) For more information, see the Mechanical, Packaging, and Orderable addendum.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) PRODUCT PREVIEW only