SWRU635 May   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Energy Trace
    4. 2.4 Hardware and Debug Setup
      1. 2.4.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.4.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    5. 2.5 BoosterPack Connector Pinout
    6. 2.6 XDS110 Interface Connector
    7. 2.7 Debug Interface Connector
    8. 2.8 Jumper Information
    9. 2.9 Push Buttons
  9. 3Advanced Use of the LaunchPad Hardware
    1. 3.1 External Antenna
    2. 3.2 XDS110 GPIOs
    3. 3.3 Reset Selection on BoosterPack Connector
    4. 3.4 I2C Pullup Resistors
  10. 4Software
    1. 4.1 Getting Started
    2. 4.2 Out of Box Demo
  11. 5Hardware Design Files
    1. 5.1 Reference Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

5.1 Reference Schematics

Figure 5-1, Figure 5-2, Figure 5-3, show the schematic implementation of the LP-EM-CC2745R10-Q1. The full LP-EM-CC22745R10-Q1 reference schematic can be downloaded from LP-EM-CC22745R10 design files.

LP-EM-CC2745R10-Q1 LP-EM-CC2745R10-Q1 Schematic Page 1Figure 5-1 LP-EM-CC2745R10-Q1 Schematic Page 1
LP-EM-CC2745R10-Q1 LP-EM-CC2745R10-Q1 Schematic Page 2Figure 5-2 LP-EM-CC2745R10-Q1 Schematic Page 2
LP-EM-CC2745R10-Q1 LP-EM-CC2745R10-Q1 Schematic Page 3Figure 5-3 LP-EM-CC2745R10-Q1 Schematic Page 3