TIDUF35A June   2023  – October 2024 AM6442

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Terminology
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1  AM6442 Microprocessor
      2. 2.3.2  DP83867 gigabit Ethernet Physical Transceiver
      3. 2.3.3  DP83TD510E Single-Pair Ethernet Physical Transceiver
      4. 2.3.4  MSPM0G1107 Microcontroller
      5. 2.3.5  LMK1C1106 6-Channel Output LVCMOS 1.8V Buffer
      6. 2.3.6  LMK6C Low-Jitter, High-Performance, Bulk-Acoustic-Wave (BAW) Fixed-Frequency LVCMOS Oscillator
      7. 2.3.7  TLVM13630 High-Density, 3V to 36V Input, 1V to 6V Output, 3A Step-Down Power Module
      8. 2.3.8  LM74700-Q1 Reverse-Polarity Protection Ideal Diode
      9. 2.3.9  TPS62825A Synchronous Step-Down DC-DC Converter
      10. 2.3.10 LMR36006 Ultra-Small Synchronous Step-Down Converter
      11. 2.3.11 TLV62568A High-Efficiency Step-Down Buck Converter With Forced PWM
  9. 3System Design Theory
    1. 3.1 Power Subsystem
    2. 3.2 AM6442 System on Module Subsystem
    3. 3.3 Ethernet Subsystem
    4. 3.4 Power Over Data Line (PoDL) Subsystem
    5. 3.5 Additional Subsystems
      1. 3.5.1 USB 3.1 Interface
      2. 3.5.2 Micro SD Card Interface
      3. 3.5.3 SimpleLink CC3301 Wi-Fi 6 and Bluetooth Low-Energy BoosterPack Interface
      4. 3.5.4 AM6442 UART Interface
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
      1. 4.1.1 Board Interface
        1. 4.1.1.1 Boot Switch Configuration
        2. 4.1.1.2 Starting up the Reference Design
    2. 4.2 Software Requirements
      1. 4.2.1 PoDL PSE Protocol Programming
      2. 4.2.2 Create an SD Card Image With U-Boot and Linux
    3. 4.3 Test Setup and Procedure
  11. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
    2. 5.2 Documentation Support
    3. 5.3 Support Resources
    4. 5.4 Trademarks
  12. 6About the Author
  13. 7Revision History

3.2 AM6442 System on Module Subsystem

This section gives details about the AM6442 system on module on the reference design. Figure 3-3 shows the system-on-module (SOM) block diagram.

TIDA-010262 TQMa64xxL System-on-Module Block DiagramFigure 3-3 TQMa64xxL System-on-Module Block Diagram

The TQMa64xxL embedded module is based on the AM64x processor family. This land grid array (LGA) module is designed to use the pin-compatible processors on one module design. This module is design for headless applications with extended real-time requirements. The CPU offers integrated programmable real time unit (PRU) up to four times gigabit Ethernet interfaces with TSN support for the realization of real-time applications. In addition, the processor has various interfaces such as USB 2.0, CAN-FD, UART, SerDes, and so forth.

The SOM simplifies the PCB development because all of the sensitive signals, like the DDR memory interface and the power management are encapsulated within the SOM. The SOM supports a land grid array (LGA), which is directly soldered onto the carrier board. Most of the AM6442 signals are exposed on the balls of the SOM, and are accessible by this reference design, like five RGMII interfaces, USB 3 interface, SPI, UART, and GPIOs.

TIDA-010262 TQMa64xxL Power Block DiagramFigure 3-4 TQMa64xxL Power Block Diagram

The power supply of the SOM requires 5V via the LGA-balls. The 5V power supply is generated by the power supply subsystem in this reference design. Refer to the design checklist from TQ for additional details about how to integrate the SOM onto a carrier board.