TIDUFC9 May 2025
There are three things to consider with the PCB: thermal dissipation, electromagnetic emissions, and signal integrity. All three of these considerations are especially critical when designing the layout around the TAS5441-Q1.
The TAS5441-Q1 can drive up to 22W of power through a load. While the TAS5411-Q1 is efficient, some losses dissipate as heat. The thermal pad on the bottom of the TAS5411-Q1 must be connected to a ground plane through vias directly below the thermal pad. Additionally, place a ground plane on the top layer with enough space around the TAS5411-Q1 to help dissipate the heat.
Electromagnetic emissions can occur because of the switching waveforms of the class-D amplifier output drivers. Reducing the area of these switching nodes and providing low inductance current paths reduces unwanted emissions. In particular, keep the traces from the outputs to the LC filter short, with a compact route back to ground.
Signal integrity is important in the path from the audio codec to the class-D amplifier inputs.
This is a differential analog signal. To protect the signal from unwanted noise, it is best if the traces from the audio codec can be kept short and for the traces to be routed directly above a ground plane without any digital signals crossing on the other layers.