TIDUFC9 May   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Codec Design
      2. 2.2.2 Class-D Amplifier
        1. 2.2.2.1 Audio Filter Design
      3. 2.2.3 Power Design
      4. 2.2.4 EMC, EMI Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 TAC5312-Q1
      2. 2.3.2 TAS5441-Q1
      3. 2.3.3 LMR43620-Q1
      4. 2.3.4 TPS7A52-Q1
      5. 2.3.5 TPD2E007
  9. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Board Connection
      2. 3.1.2 Configuring the Board
    2. 3.2 Software Requirements
      1. 3.2.1 Firmware for Bench Tests
    3. 3.3 Test Setup
    4. 3.4 Test Results
      1. 3.4.1 Audio Performance
      2. 3.4.2 Power Tests
      3. 3.4.3 EMI, EMC Test Results
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 Bill of Materials
      3. 4.1.3 PCB Layout Recommendations
        1. 4.1.3.1 Layout Prints
      4. 4.1.4 Altium Project
      5. 4.1.5 Gerber Files
      6. 4.1.6 Assembly Drawings
    2. 4.2 Documentation Support
    3. 4.3 Support Resources
    4. 4.4 Trademarks
  11. 5About the Author

2.3.5 TPD2E007

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system-level ESD designs for a wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (level 4) ESD protection and is an excellent choice for providing system-level ESD protection for the internal ICs when placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar™ package and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only a 0.15mm (maximum) package height, is recommended for ultra space-saving applications where the package height is a key concern. The PicoStar package can be used in either embedded printed-circuit board (PCB) applications or in surface-mount applications. The industry standard SOT package offers a straightforward board layout option in legacy designs.

TIDA-060048 TPD2E007 Simplified Schematic Figure 2-14 TPD2E007 Simplified Schematic