SLAAET8 April   2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G1519 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3519 , MSPM0L1105 , MSPM0L1106 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2227-Q1 , MSPM0L2228 , MSPM0L2228-Q1

1.   1
2.   Abstract
3.   Trademarks
4. 1Introduction
5. 2EMC and EMC Standards
   1. 2.1 EMC
      1. 2.1.1 EMS
      2. 2.1.2 EMI
   2. 2.2 EMC Standards
      1. 2.2.1 EMC Standards Category
   3. 2.3 EMC and IC Electrical Reliability in TI
6. 3EMC Improvement Guidelines Summary
   1. 3.1 PCB Design Guidelines
   2. 3.2 Firmware Guidelines
7. 4EMC Improvement Features on MSPM0
   1. 4.1 Susceptibility Protection Features
      1. 4.1.1 POR and BOR
      2. 4.1.2 NMI and Hard Fault
      3. 4.1.3 I/O ESD and Settings
   2. 4.2 Emission Reduction Features
      1. 4.2.1 Clock Source
      2. 4.2.2 Power Modes
      3. 4.2.3 Package
8. 5Analysis for EMS Test
   1. 5.1 Root Cause Analysis
      1. 5.1.1 Permanent Damage
      2. 5.1.2 Recoverable Malfunction
   2. 5.2 Debug Flow
9. 6Analysis for EMI Test
   1. 6.1 Root Cause Analysis
      1. 6.1.1 Power Line
      2. 6.1.2 External Vcore
   2. 6.2 Debug Flow
10. 7Summary
11. 8References

EMC Improvement Guide for MSPM0