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MOSFET power stages

Increase system efficiency and simplify design

Shrink overall solution size, maximize power density, optimize efficiency, and strengthen system protection with MOSFET power stages. Pair TI’s NexFET™ power MOSFET stage products and our multiphase controllers to eliminate unnecessary components from your design, reduce switching losses, and improve system reliability – all within the smallest footprint.

High efficiency

PowerStack™ packing technology eliminates parasitics and reduces switching losses, while a large ground lead frame provides excellent thermal performance.

Enhanced diagnostic feedback

Cycle-by-cycle accurate temperature compensated bidirectional current sense improves system monitoring and temperature. Additionally, fault monitoring improves system reliability.

High integration

Integrated MOSFETs, driver and current sense provide a complete switching function that eliminates passive components to reduce solution size and simplify PCB layout.

Featured products


75-A synchronous buck NexFET™ Smart Power Stage with DualCool™ package.


50-A synchronous buck NexFET™ Smart Power Stage in small 4 x 5 SON package.


70-A synchronous buck NexFET™ Smart Power Stage in an industry standard footprint.

Seamless integration

The NexFET™ Rower Block pairs seamlessly with our multiphase step-down controllers for an efficient design in a reduced solution size.

Featured technical content

Power loss calculation with CSI consideration for synchronous buck converters (Rev. A)

The synchronous buck converter is a widely used topology in low-voltage, high-current applications. Low-power loss and highly efficient synchronous buck converters are in great demand for advanced microprocessors of the future.

In today’s computing environment, CPUs, FPGAs, ASICs and even peripherals are growing increasingly complex and, consequently, so do their power delivery requirements.

Technical Article

Multiphase power blogs

Featured video

A deeper look into the construction of our smart power stages and how packaging can enhance circuit performance.