Power modules

TI's broad portfolio of power modules with integrated inductors and innovative packaging technology, like those that utilize our MagPack™ package, help solve board space constraints while delivering high performance.

• Reduce overall solution size with component integration to maximize power density.
• Simplify the design process with easy-to-use, highly integrated devices.
• Enable lower EMI levels for cleaner, more reliable performance.

Our new portfolio of isolated power modules using the proprietary IsoShield™ technology packs up to three times the power density of discrete solutions. This enables more compact and robust power supply designs for automotive and industrial applications requiring basic or reinforced isolation.

• Reduce footprint size to maximize power density for isolated designs.
• Attain higher levels of safety, reliability, and system robustness.
• Improve efficiency and reduce temperature rise compared to existing modules.
• Cut design time with highly integrated devices.

TI’s latest addition to the multiphase power portfolio helps address the rapid increase in processing power required by modern data centers, driven by the growing computational demands of AI. These power modules integrate power stages and inductors into a single solution to deliver higher power density. 

• Maximize power density compared to discrete power stage and inductor based solutions.
• Follows the industry common footprint to support multisourcing.
• Integrated trans-inductor voltage regulator (TLVR) options available for improved transient performance.

Integrated GaN power modules deliver greater than 99% inverter efficiency, significantly enhancing thermal performance and minimizing power loss. 

• Advanced integration and increased power density enable a smaller solution footprint and reduce system-level costs.
• Minimize dead time and propagation delay to limit current harmonics and support more precise current sensing.
• Zero-reverse recovery and comprehensive protection features optimize power efficiency, boosting system reliability.

IsoShield packaging technology use internal metal layers within the package substrate to create a Faraday cage-like structure. This formation contains electromagnetic emissions, significantly reducing EMI without external shielding components or complex PCB layout techniques. The shield layers are also strategically placed on high-frequency switching nodes to target the most likely possibilites of EMI radiation.

Benefits:

• Meet EMI compliance through this package implementing proprietery EMI mitigating technology.
• Simplify your design by eliminating external EMI-shielding components.
• Accelerate time-to-market by decreasing the need for debugging and compliance testing.

Our MagPack technology integrates a custom-built inductor for the IC, ensuring the entire package is optimized as a single system. This unified design approach delivers superior thermal performance, efficiently transferring heat away from both the IC and inductor to keep the system running cooler and more reliably.

Benefits:

• Increase power density through a compact, fully optimized package design.
• Maximize system efficiency by reducing DC losses and AC switching losses.
• Protect your board with superior EMI shielding for the entire package, not just the inductor.

Our power modules with overmolded packaging fully self-contain all components within an enclosed plastic molding compound. This type of packaging is ideal for space-constrained, noise-sensitive applications as it is compact and reliable. This package also comes in two main variants: leadframe-based, where the components are mounted directly onto the leadframe, and PCB laminate-based, where components are mounted and routed on the laminate substrate to save even more space.

Benefits:

• Improve EMI performance through a leadframe-based, enclosed solution.
• Minimize PCB footprint with a compact package that utilizes standard instead of stilted inductors.

Open-frame packaging integrates our standard power module switching and passive components onto a multilayer laminate PCB substrate, but does not encapsulate them in a plastic casing. This results in the components being fully exposed, allowing for increased airflow.

Benefits:

• Boost system performance through better heat dissipation and air cooling.
• Power more demanding loads using these packages with higher output current capabilities.

Power modules utilizing the low-profile package type prioritize reducing Z-height. This package has a QFN footprint and uses smaller or redistributed inductors to save space. The reduced size of these packages opens up unique placement options, such as on the back side of the PCB.

Benefits:

• Enhance efficiency by decreasing parasitic trace length through placing modules closer to the load.
• Further reduce system size by saving space in all three axes.

As the name suggests, this type of packaging features an inductor that is placed on the exterior of the module's standard packaging. The rest of the circuitry is enclosed within the mold compound and power connectors connect the inductor to the subtrate. This design allows for the inductor to be optimized independently of the package constraints to achieve desired electrical performance, while also enabling direct access to the top of the inductor for easier switching node waveform measurement.

Benefits:

• Improve thermal performance through enhanced heat dissipation from the inductor core directly to airflow or a heatsink.
• Measure operation and debug easier through direct access to the top of the inductor.