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BQ500101

ACTIVE

NexFET Power Stage

Product details

Rating Catalog VDS (V) 30 Ploss current (A) 5 Features Ultra-low inductance package Operating temperature range (°C) -40 to 125
Rating Catalog VDS (V) 30 Ploss current (A) 5 Features Ultra-low inductance package Operating temperature range (°C) -40 to 125
VSON-CLIP (DPC) 8 15.75 mm² (4.5 mm × 3.5 mm)
  • 98% System Efficiency at 5 A
  • Max Rated Continuous Current 10 A, Peak 15 A
  • High-Frequency Operation (up to 600 kHz)
  • High-Density SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3-V and 5-V PWM Signal Compatible
  • Input Voltages up to 24 V
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • Optimized Power Stage Containing High-
    Efficiency Gate Drivers and FETs
  • Optimized for 15-W Wireless Power Transmitter Designs
  • 98% System Efficiency at 5 A
  • Max Rated Continuous Current 10 A, Peak 15 A
  • High-Frequency Operation (up to 600 kHz)
  • High-Density SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3-V and 5-V PWM Signal Compatible
  • Input Voltages up to 24 V
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • Optimized Power Stage Containing High-
    Efficiency Gate Drivers and FETs
  • Optimized for 15-W Wireless Power Transmitter Designs

The bq500101 NexFET Power Stage is optimized for wireless power applications covering the WPC v1.2 medium power specification. The device can be used for both the rail voltage control in fixed frequency transmitter types as well as the coil drivers for both fixed and variable frequency types. This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The bq500101 NexFET Power Stage is optimized for wireless power applications covering the WPC v1.2 medium power specification. The device can be used for both the rail voltage control in fixed frequency transmitter types as well as the coil drivers for both fixed and variable frequency types. This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

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Top documentation Type Title Format options Date
* Data sheet bq500101 NexFET Power Stage datasheet PDF | HTML Mar 3, 2016

Design & development

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Simulation model

BQ500101 PSpice Transient Model

SLPM277.ZIP (49 KB) - PSpice model
Supported products & hardware
Simulation model

BQ500101 TINA-TI Reference Design

SLPM275.TSC (179 KB) - TINA-TI reference design
Supported products & hardware
Simulation model

BQ500101 TINA-TI Transient Spice Model

SLPM276.ZIP (51 KB) - TINA-TI Spice model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
VSON-CLIP (DPC) 8 Ultra Librarian

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