CD4011B

ACTIVE

CMOS Quad 2-Input NAND Gate

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Product details

Parameters

Technology Family CD4000 VCC (Min) (V) 3 VCC (Max) (V) 18 Channels (#) 4 Inputs per channel 2 IOL (Max) (mA) 6.8 IOH (Max) (mA) -6.8 Input type Standard CMOS Output type Push-Pull Features Standard Speed (tpd > 50ns) Data rate (Max) (Mbps) 8 Rating Catalog Operating temperature range (C) -55 to 125 open-in-new Find other NAND gate

Package | Pins | Size

PDIP (N) 14 181 mm² 19.3 x 9.4 SOIC (D) 14 52 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 open-in-new Find other NAND gate

Features

  • Propagation delay time = 60 ns (typ.) at CL = 50 pF, VDD = 10 V
  • Buffered inputs and outputs
  • Standardized symmetrical output characteristics
  • Maximum input current of 1 µA at 18 V over-full package temperature range; 100 nA at 18 V and 25°C
  • 100% tested for quiescent current at 20 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Noise margin (over full package temperature range:
        1 V at VDD = 5 V
        2 V at VDD = 10 V
        2.5 at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of "B" Series CMOS Devices"

Quad 2 Input—CD4011B
Dual 4 Input—CD4012B
Triple 3 Input—CD4023B
Data sheet acquired from Harris Semiconductor.

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Description

CD4011B, CD4012B, and CD4023B NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of CMOS gates. All inputs and outputs are buffered.

The CD4011B, CD4012B, and CD4023B types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PWR suffix). The CD4011B and CD4023B types also are supplied in 14-lead thin shrink small-outline packages (PW suffix).

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Technical documentation

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Type Title Date
* Datasheet CD4011B, CD4012B, CD4023B TYPES datasheet (Rev. D) Aug. 21, 2003
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Solution guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics Dec. 03, 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$10.00
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODELS Download
SCHM032.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 14 View options
SOIC (D) 14 View options
TSSOP (PW) 14 View options

Ordering & quality

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