CD74HC4051-Q1

ACTIVE

Automotive 5-V, 8:1, 1-channel analog mutliplexer

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Automotive 5-V, 8:1, 1-channel analog mutliplexer

CD74HC4051-Q1

ACTIVE

Product details

Parameters

Configuration 8:1 Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 40 ON-state leakage current (Max) (µA) 2 Bandwidth (MHz) 180 Operating temperature range (C) -40 to 125 Features Break-before-make Input/output continuous current (Max) (mA) 25 Rating Automotive CON (Typ) (pF) 25 Supply current (Typ) (uA) 16 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • Wide Analog Input Voltage Range of ±5 V Max
  • Low ON Resistance
    • 70 Typical (VCC – VEE = 4.5 V)
    • 40 Typical (VCC – VEE = 9 V)
  • Low Crosstalk Between Switches
  • Fast Switching and Propagation Speeds
  • Break-Before-Make Switching
  • Operation Control Voltage = 2 V to 6 V
  • Switch Voltage = 0 V to 10 V
  • High Noise Immunity NIL = 30%, NIH = 30% of VCC, VCC = 5 V

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Description

This device is a digitally controlled analog switch that utilizes silicon-gate CMOS technology to achieve operating speeds similar to LSTTL, with the low power consumption of standard CMOS integrated circuits.

This analog multiplexer/demultiplexer controls analog voltages that may vary across the voltage supply range (i.e., VCC to VEE). These bidirectional switches allow any analog input to be used as an output and vice versa. The switches have low ON resistance and low OFF leakages. In addition, the device has an enable control E that, when high, disables all switches to their OFF state.

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Technical documentation

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Type Title Date
* Data sheet Analog Multiplexer/Demultiplexer datasheet (Rev. A) Apr. 24, 2008
Application note Selecting the Right Texas Instruments Signal Switch (Rev. C) Aug. 06, 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) Jul. 26, 2021
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
More literature Automotive Logic Devices Brochure Aug. 27, 2014
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions May 01, 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

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Hardware development

INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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