CD74HCT4066-Q1

ACTIVE

Automotive 9-V, 1:1 (SPST), 4-channel high-speed switch

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Automotive 9-V, 1:1 (SPST), 4-channel high-speed switch

CD74HCT4066-Q1

ACTIVE

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 5 Ron (Typ) (Ohms) 25 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 125 Input/output continuous current (Max) (mA) 25 Rating Automotive CON (Typ) (pF) 5 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 14 52 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • Low ON Resistance
    • 25 Ω Typical (VCC = 4.5 V)
  • Fast Switching and Propagation Speeds
  • Low OFF Leakage Current
  • Wide Operating Temperature Range: –40°C to 125°C
  • Direct LSTTL Input Logic Compatibility:
        VIL = 0.8 V Max, VIH = 2 V Min
  • CMOS Input Compatibility: II ≤ 1 µA at VOL, VOH

open-in-new Find other Analog switches & muxes

Description

The CD74HCT4066 contains four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operation speeds similar to LSTTL, with the low power consumption of standard CMOS integrated circuits.

These switches feature the characteristic linear ON resistance of the metal-gate CD4066B. Each switch is turned on by a high-level voltage on its control input.

open-in-new Find other Analog switches & muxes
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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 16
Type Title Date
* Datasheet Highe-Speed CMOS Logic Quad Bilateral Switch datasheet (Rev. B) Apr. 24, 2008
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
More literature Automotive Logic Devices Brochure Aug. 27, 2014
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions May 01, 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

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Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
SOIC (D) 14 View options
TSSOP (PW) 14 View options

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Qualification summary
  • Ongoing reliability monitoring

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