NEW

DDC3512

ACTIVE

512 Channel, 20KSPS Current Input Analog to Digital Converter

Product details

Operating temperature range (°C) 0 to 70 Rating Catalog
Operating temperature range (°C) 0 to 70 Rating Catalog
NFBGA (ZWR) 656 227.04 mm² 17.2 x 13.2
  • Single-chip design to directly measure 512 low-level currents simultaneously
  • Adjustable full-scale charge range up to 600pC
  • Input current: 1µA (maximum)
  • Adjustable speed with integration times as low as 50µs (20 KSPS per channel)
  • Resolution: 24 bit
  • Low power dissipation: 1.2mW/channel
  • Integral non-linearity: ±0.025% of reading ±1ppm of full scale range (all channels active)
  • Low noise: 0.26 fCrms at 600pC FSR with 20pF sensor capacitance
  • No charge loss
  • On-chip temperature sensor
  • Serial LVDS output interface
  • Single 1.85V supply
  • In-package bypass capacitors and reference buffer to reduce PCB area and design complexity
  • Single-chip design to directly measure 512 low-level currents simultaneously
  • Adjustable full-scale charge range up to 600pC
  • Input current: 1µA (maximum)
  • Adjustable speed with integration times as low as 50µs (20 KSPS per channel)
  • Resolution: 24 bit
  • Low power dissipation: 1.2mW/channel
  • Integral non-linearity: ±0.025% of reading ±1ppm of full scale range (all channels active)
  • Low noise: 0.26 fCrms at 600pC FSR with 20pF sensor capacitance
  • No charge loss
  • On-chip temperature sensor
  • Serial LVDS output interface
  • Single 1.85V supply
  • In-package bypass capacitors and reference buffer to reduce PCB area and design complexity

The DDC3512 is a 24-bit, 512-channel, current-input analog-to-digital (A/D) converter. The device combines both, current-to-voltage conversion by current integration, and A/D conversion. The device is a stacked-die version of DDC3256, with one die of the latter sitting on top of the other.

Up to 512 individual low-level current output devices, such as photodiodes, can be directly connected to the inputs and digitized in parallel (simultaneously).

For each of the 512 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50µs to 1.6ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count.

The DDC3512 operates from single 1.85V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2mm2 656-ball 0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.

The DDC3512 is a 24-bit, 512-channel, current-input analog-to-digital (A/D) converter. The device combines both, current-to-voltage conversion by current integration, and A/D conversion. The device is a stacked-die version of DDC3256, with one die of the latter sitting on top of the other.

Up to 512 individual low-level current output devices, such as photodiodes, can be directly connected to the inputs and digitized in parallel (simultaneously).

For each of the 512 inputs, the device has one low noise and low power integrator designed to capture all the charge from the sensor. The integration time is adjustable from 50µs to 1.6ms, allowing currents in the order of fA to µA to be continuously measured with outstanding precision. The outputs of the integrators are digitized by on-chip low power ADCs and the converted digital codes are transmitted over a single LVDS pair designed to minimize noise coupling in environments with high channel count.

The DDC3512 operates from single 1.85V supply. The device is specified from 0°C to 70°C operating temperature and available in a 13.2 × 17.2mm2 656-ball 0.8mm row-pitch and 0.4mm column-pitch BGA. The on-chip reference buffer and bypass capacitors (on the BGA) help minimize the external component requirements and further reduce board space.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Top documentation Type Title Format options Date
* Data sheet DDC3512 512-Channel, Current-Input Analog-To-Digital Converter datasheet PDF | HTML 31 Oct 2025

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

DDC3256EVM — DDC3256 evaluation module

The DDC3256EVM is used for evaluation module for DDC3256 device. The EVM kit is comprised of DUT board which seamlessly integrates with TSWDC155EVM evaluation module FPGA for data capture. The EVM contains all necessary control signals and on-board power generation which greatly reduces the need (...)

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins CAD symbols, footprints & 3D models
NFBGA (ZWR) 656 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos