Product details

Technology Family TTL Supply voltage (Min) (V) 4.5 Supply voltage (Max) (V) 5.5 Number of channels (#) 4 Inputs per channel 2 IOL (Max) (mA) 0.8 IOH (Max) (mA) -16 Input type Bipolar Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (Max) (Mbps) 70 Rating Military Operating temperature range (C) -55 to 125
Technology Family TTL Supply voltage (Min) (V) 4.5 Supply voltage (Max) (V) 5.5 Number of channels (#) 4 Inputs per channel 2 IOL (Max) (mA) 0.8 IOH (Max) (mA) -16 Input type Bipolar Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (Max) (Mbps) 70 Rating Military Operating temperature range (C) -55 to 125
CDIP (J) 14 130 mm² 19.94 x 6.73 CFP (W) 14 55 mm² 9.2 x 6.39
  • Package Options Include Plastic “Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

 

  • Package Options Include Plastic “Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability

 

These devices contain four independent 2-input OR gates.

The SN5432, SN54LS32 and SN54S32 are characterized for operation over the full military range of -55°C to 125°C. The SN7432, SN74LS32 and SN74S32 are characterized for operation from 0°C to 70°C.

 

These devices contain four independent 2-input OR gates.

The SN5432, SN54LS32 and SN54S32 are characterized for operation over the full military range of -55°C to 125°C. The SN7432, SN74LS32 and SN74S32 are characterized for operation from 0°C to 70°C.

 

Download

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Type Title Date
* Data sheet Quadruple 2-Input Positive-OR Gates datasheet 01 Mar 1988
* SMD SN5432 SMD 5962-95574 21 Jun 2016
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
CDIP (J) 14 View options
CFP (W) 14 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos