SN74ABT16241A

ACTIVE

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

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16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

SN74ABT16241A

ACTIVE

Product details

Parameters

Technology Family ABT Supply voltage (Min) (V) 4.5 Supply voltage (Max) (V) 5.5 Number of channels (#) 16 IOL (Max) (mA) 64 ICC (Max) (uA) 34000 IOH (Max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state Rating Catalog open-in-new Find other Noninverting buffers & drivers

Package | Pins | Size

SSOP (DL) 48 164 mm² 15.88 x 10.35 TSSOP (DGG) 48 101 mm² 12.5 x 8.1 TVSOP (DGV) 48 62 mm² 9.7 x 6.4 open-in-new Find other Noninverting buffers & drivers

Features

  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Latch-Up Performance Exceeds 500 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
  • Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.


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Description

The 'ABT16241A devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and complementary output-enable (OE and OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN54ABT16241A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16241A is characterized for operation from -40°C to 85°C.

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Technical documentation

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Type Title Date
* Data sheet 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. G) Oct. 28, 1998
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) Jul. 26, 2021
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) Feb. 16, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
Selection guide Advanced Bus Interface Logic Selection Guide Jan. 09, 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) Mar. 01, 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Design tools & simulation

SIMULATION MODEL Download
SCBM153.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
SSOP (DL) 48 View options
TSSOP (DGG) 48 View options
TVSOP (DGV) 48 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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