SN74ABT16241A

ACTIVE

16-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs and 3-state outputs

Order now

Data sheet

document-pdfAcrobat 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. G)

SN74ABT16241A

ACTIVE

Data sheet

Order now

Product details

Technology family

ABT

Number of channels

16

IOL (max) (mA)

64

Supply current (max) (µA)

34000

IOH (max) (mA)

-32

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Technology family

ABT

Number of channels

16

IOL (max) (mA)

64

Supply current (max) (µA)

34000

IOH (max) (mA)

-32

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

SSOP (DL)

48

164.358 mm² (15.88 mm × 10.35 mm)

TVSOP (DGV)

48

62.08 mm² (9.7 mm × 6.4 mm)

TSSOP (DGG)

48

101.25 mm² (12.5 mm × 8.1 mm)

Members of the Texas Instruments Widebus^TM Family
State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
Latch-Up Performance Exceeds 500 mA
Per JESD 17
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.

Members of the Texas Instruments Widebus^TM Family
State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
Distributed V_CC and GND Pin Configuration Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
High-Drive Outputs (-32-mA I_OH, 64-mA I_OL)
Latch-Up Performance Exceeds 500 mA
Per JESD 17
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.

The 'ABT16241A devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and complementary output-enable (OE and OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN54ABT16241A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16241A is characterized for operation from -40°C to 85°C.

The 'ABT16241A devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and complementary output-enable (OE and OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CCthrough a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

The SN54ABT16241A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16241A is characterized for operation from -40°C to 85°C.

filter

Find other Noninverting buffers & drivers

Download View video with transcript Video