16-Bit Registered Transceivers With 3-State Outputs

SN74ABT16952

ACTIVE

Product details

Technology Family ABT IOL (Max) (mA) 64 IOH (Max) (mA) -32 Operating temperature range (C) -40 to 85 Rating Catalog
Technology Family ABT IOL (Max) (mA) 64 IOH (Max) (mA) -32 Operating temperature range (C) -40 to 85 Rating Catalog
SSOP (DL) 56 191 mm² 18.42 x 10.35 TSSOP (DGG) 56 113 mm² 14 x 8.1
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.

The 'ABT16952 are 16-bit registered transceivers that contain two sets of D-type flip-flops for temporary storage of data flowing in either direction. The 'ABT16952 can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB\ or CLKENBA\) input is low. Taking the output-enable (OEAB\ or OEBA\) input low accesses the data on either port.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16952 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16952 is characterized for operation from -40°C to 85°C.

The 'ABT16952 are 16-bit registered transceivers that contain two sets of D-type flip-flops for temporary storage of data flowing in either direction. The 'ABT16952 can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB\ or CLKENBA\) input is low. Taking the output-enable (OEAB\ or OEBA\) input low accesses the data on either port.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16952 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16952 is characterized for operation from -40°C to 85°C.

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Technical documentation

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Type Title Date
* Data sheet 16-Bit Registered Transceivers With 3-State Outputs datasheet (Rev. C) 01 Jan 1997
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 Feb 2004
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 Mar 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

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SSOP (DL) 56 View options
TSSOP (DGG) 56 View options

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