SN74ABT651

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Octal Bus Transceivers And Registers With 3-State Outputs

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Product details

Parameters

Technology Family ABT VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Bits (#) 8 Voltage (Nom) (V) 5 F @ nom voltage (Max) (MHz) 150 ICC @ nom voltage (Max) (mA) 0.25 Propagation delay (Max) (ns) 6.2 IOL (Max) (mA) 64 IOH (Max) (mA) -32 Operating temperature range (C) -40 to 85 open-in-new Find other Registered transceiver

Package | Pins | Size

SOIC (DW) 24 160 mm² 15.5 x 10.3 open-in-new Find other Registered transceiver

Features

  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Multiplexed Real-Time and Stored Data
  • Inverting Data Paths
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPs

EPIC-IIB is a trademark of Texas Instruments Incorporated.

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Description

These devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable (OEAB and OEBA\) inputs are provided to control the transceiver functions. The select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. A low input level selects real-time data, and a high input level selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the 'ABT651 devices.

Data on the A or B bus, or both, can be stored in the internal D flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) inputs, regardless of the select- or enable-control pins. When SAB and SBA are in the real-time transfer mode, it also is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and OEBA\. In this configuration, each output reinforces its input. When all the other data sources to the two sets of bus lines are at high impedance, each set remains at its last state.

To ensure the high-impedance state during power up or power down, OEBA\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver (B to A). OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver (A to B).

The SN54ABT651 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT651 is characterized for operation from -40°C to 85°C.

The data output functions may be enabled or disabled by a variety of level combinations at OEAB or OEBA\. Data input functions are always enabled; i.e., data at the bus terminals is stored on every low-to-high transition of the clock inputs.

When select control is low, clocks can occur simultaneously if allowances are made for propagation delays from A to B (B to A) plus setup and hold times. When select control is high, clocks must be staggered to load both registers.


Figure 1. Bus-Management Functions

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Technical documentation

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Type Title Date
* Datasheet Octal Bus Transceivers And Registers With 3-State Outputs datasheet (Rev. E) Apr. 08, 1998
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
Application notes Quad Flatpack No-Lead Logic Packages (Rev. D) Feb. 16, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
Selection guides Advanced Bus Interface Logic Selection Guide Jan. 09, 2001
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) Jun. 01, 1997
Application notes Designing With Logic (Rev. C) Jun. 01, 1997
Application notes Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) Mar. 01, 1997
Application notes Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) Dec. 01, 1996
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application notes Live Insertion Oct. 01, 1996
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

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Hardware development

EVALUATION BOARDS Download
document-generic User guide
$10.00
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

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Package Pins Download
SOIC (DW) 24 View options

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