SN74ALVC244

ACTIVE

8-ch, 1.65-V to 3.6-V buffers with 3-state outputs

Top

Product details

Parameters

Technology Family ALVC VCC (Min) (V) 1.65 VCC (Max) (V) 3.6 Channels (#) 8 IOL (Max) (mA) 24 ICC (Max) (uA) 10 IOH (Max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 TSSOP (PW) 20 42 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 VQFN (RGY) 20 16 mm² 3.5 x 4.5 open-in-new Find other Non-Inverting buffer/driver

Features

  • Operates From 1.65 V to 3.6 V
  • Max tpd of 2.8 ns at 3.3 V
  • ±24-mA Output Drive at 3.3 V
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

open-in-new Find other Non-Inverting buffer/driver

Description

This octal buffer/line driver is designed for 1.65-V to 3.6-V VCC operation.

The SN74ALVC244 is organized as two 4-bit line drivers with separate output-enable (OE)\ inputs. When OE\ is low, the device passes data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

open-in-new Find other Non-Inverting buffer/driver
Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 19
Type Title Date
* Datasheet SN74ALVC244 datasheet (Rev. G) Aug. 31, 2004
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) Aug. 01, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) Sep. 08, 1999
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 Aug. 03, 1998
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) May 13, 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
document-generic User guide
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor
DAUGHTER CARD Download
document-generic User guide
Description

TMDSCNCD280049C is an HSEC180 controlCARD based evaluation and development tool for the C2000™ F28004x series of microcontroller products. controlCARDs are ideal to use for initial evaluation and system prototyping. controlCARDs are complete board-level modules that utilize one of two standard form (...)

Features

Hardware Features

  • Isolated on-board XDS100v2 USB-to-JTAG debug probe enables real-time in-system programming and debugging
  • Standard 180-pin controlCARD HSEC interface
  • Analog I/O, digital I/O and JTAG signals at card interface
  • Hardware Files are in C2000Ware at boards\controlCARDs\TMDSCNCD280049C

Software (...)

DAUGHTER CARD Download
document-generic User guide
159
Description

TMDSCNCD28379D is an HSEC180 controlCARD based evaluation and development tool for the F2837xD,  F2837xS, and F2807x series in the TI MCU. controlCARDs are ideal to use for initial evaluation and system prototyping. controlCARDs are complete board-level modules that utilize one of two standard (...)

Features

Hardware Features

  • TMDSCNCD28379D: TMS320F28379D HSEC180 based controlCARD
    • Isolated XDS100v2 USB-to-JTAG Debug Probe enables real-time in-system programming and debugging
  • Standard 180-pin HSEC interface
  • Analog I/O, digital I/O and JTAG signals at card interface
  • USB Host connector
  • SDCard Slot
  • Hardware Files (...)
DEVELOPMENT KIT Download
document-generic User guide
219
Description

TMDSDOCK28379D is a HSEC180 controlCARD based evaluation and development tool for the C2000™ Delfino™ F2837x and Piccolo F2807x series of microcontroller products. The Docking Station provides power to the controlCARD and has a bread-board area for prototyping. Access to the key device (...)

Features

Hardware Features

  • TMDSCNCD28379D: TMS320F28379D HSEC180 based controlCARD
    • Isolated XDS100v2 USB-to-JTAG Debug Probe enables real-time in-system programming and debugging
  • Bread-board like baseboard with HSEC180 controlCARD female connector
    • Header pin access to key MCU signals
    • Breadboard area for (...)

Design tools & simulation

SIMULATION MODEL Download
SCEM386A.ZIP (45 KB) - IBIS Model
SIMULATION MODEL Download
SCEM761.ZIP (7 KB) - PSpice Model

Reference designs

REFERENCE DESIGNS Download
4-kW interleaved CCM totem pole bridgeless PFC reference design using C2000™ MCU and GaN
PMP40690 — This reference design is a 4-kW interleaved CCM totem pole (TTPL) bridgeless PFC reference design using a 64-pin C2000™ microcontroller, LM3410 gallium nitride device and TMCS1100 hall sensor. It is based on TIDM-02008 bidirectional interleaved CCM TTPL bridgeless PFC reference (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Industrial Servo Drive and AC Inverter Drive Reference Design
TIDM-SERVODRIVE The DesignDRIVE Development Kit is a reference design for a complete industrial drive directly connecting to a three phase ACI or PMSM motor. Many drive topologies can be created from the combined control, power and communications technologies included on this single platform.  Includes (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Camera Reference Design for ARM® Cortex®-M Microcontrollers (MCUs)
TIDM-TM4C129CAMERA This design implements a network camera with a QVGA display panel and an embedded web server for remote monitoring.  With a memory footrpint of 250KB for the web server, there is ample memory available on the TM4C129x microcontroller for additional customizations.
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
SO (NS) 20 View options
SOIC (DW) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options
VQFN (RGY) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos