SN74AUC1G240

ACTIVE

Single Buffer/Driver With 3-State Output

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Single Buffer/Driver With 3-State Output

SN74AUC1G240

ACTIVE

Product details

Parameters

Technology Family AUC VCC (Min) (V) 0.8 VCC (Max) (V) 2.7 Channels (#) 1 IOL (Max) (mA) 9 IOH (Max) (mA) -9 ICC (Max) (uA) 10 Input type Standard CMOS Output type 3-State Features Balanced outputs, Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs Data rate (Mbps) 500 Rating Catalog open-in-new Find other Inverting buffer/driver

Package | Pins | Size

DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1 open-in-new Find other Inverting buffer/driver

Features

  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 2.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Max ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments

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Description

This bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 18
Type Title Date
* Datasheet Single Buffer/Driver With 3-State Output datasheet (Rev. I) Feb. 05, 2007
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices Mar. 21, 2003
User guide AUC Data Book, January 2003 (Rev. A) Jan. 01, 2003
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature AUC Product Brochure (Rev. A) Mar. 18, 2002

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SCEJ138.ZIP (42 KB) - HSpice Model
SIMULATION MODEL Download
SCEM721.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 5 View options
SC70 (DCK) 5 View options
SOT-23 (DBV) 5 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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