SN74CB3Q6800

ACTIVE

3.3-V, 1:1 (SPST), 10-channel general-purpose FET bus switch with precharged outputs

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3.3-V, 1:1 (SPST), 10-channel general-purpose FET bus switch with precharged outputs

SN74CB3Q6800

ACTIVE

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 10 Power supply voltage - single (V) 2.5, 3.3 Ron (Typ) (Ohms) 4.5 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (Max) (mA) 64 Rating Catalog CON (Typ) (pF) 9 Supply current (Typ) (uA) 750 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SSOP (DBQ) 24 52 mm² 8.65 x 6 TSSOP (PW) 24 34 mm² 4.4 x 7.8 TVSOP (DGV) 24 32 mm² 5 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • High-Bandwidth Data Path (Up To 500 MHz)
  • 5-V Tolerant I/Os with Device Powered-Up or Powered-Down
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4.5 Typical)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0- to 5-V Switching With 3.3-V VCC
    • 0- to 3.3-V Switching With 2.5-V VCC
  • B-Port Outputs Are Precharged by Bias Voltage (BIASV) to Minimize Signal Distortion During Live Insertion and Hot-Plugging
  • Supports PCI Hot Plug
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 3.5 pF Typical)
  • Fast Switching Frequency (fON\= 20 MHz Max)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 0.75 mA Typical)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
  • Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications: PCI Interface, Differential Signal Interface, Memory Interleaving, Bus Isolation, Low-Distortion Signal Gating

For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008.

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Description

The SN74CB3Q6800 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q6800 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems.

The SN74CB3Q6800 is a 10-bit bus switch with a single output-enable (ON\) input. When ON\ is low, the 10-bit bus switch is ON and the A port is connected to the B port, allowing bidirectional data flow between ports. When ON\ is high, the 10-bit bus switch is OFF and a high-impedance state exists between the A and B ports. The B port is precharged to bias voltage (BIASV) through the equivalent of a 10-k resistor when ON\ is high, or if the device is powered down (VCC = 0 V).

During insertion (or removal) of a card into (or from) an active bus, the card’s output voltage may be close to GND. When the connector pins make contact, the card’s parasitic capacitance tries to force the bus signal to GND, creating a possible glitch on the active bus. This glitching effect can be reduced by using a bus switch with precharged bias voltage (BIASV) of the bus switch equal to the input threshold voltage level of the receivers on the active bus. This method will ensure that any glitch produced by insertion (or removal) of the card will not cross the input threshold region of the receivers on the active bus, minimizing the effects of live-insertion noise.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, ON\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 14
Type Title Date
* Datasheet SN74CB3Q6800 datasheet (Rev. A) Nov. 20, 2003
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. A) Jun. 30, 2020
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families Feb. 04, 2003

Design & development

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Hardware development

INTERFACE ADAPTER Download
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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODEL Download
SCDM042.ZIP (25 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SSOP (DBQ) 24 View options
TSSOP (PW) 24 View options
TVSOP (DGV) 24 View options

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