SN74CBT3305C

ACTIVE

5-V, 1:1 (SPST), 2-channel FET bus switch with –2-V undershoot protection (active high)

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5-V, 1:1 (SPST), 2-channel FET bus switch with –2-V undershoot protection (active high)

SN74CBT3305C

ACTIVE

Product details

Parameters

Configuration 1:1 SPST Number of channels (#) 2 Power supply voltage - single (V) 5 Ron (Typ) (Ohms) 3 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports I2C signals, Undershoot protection Input/output continuous current (Max) (mA) 128 Rating Catalog CON (Typ) (pF) 12.5 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 8 19 mm² 3.91 x 4.9 TSSOP (PW) 8 19 mm² 3 x 6.4 open-in-new Find other Analog switches & muxes
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Technical documentation

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Type Title Date
* Datasheet SN74CBT3305C datasheet (Rev. B) Aug. 09, 2005
Application notes CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. A) Jun. 30, 2020
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application notes CBT-C, CB3T, and CB3Q Signal-Switch Families Feb. 04, 2003

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODELS Download
SCDM037.ZIP (25 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SOIC (D) 8 View options
TSSOP (PW) 8 View options

Ordering & quality

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