SN74CBTLV3383

ACTIVE

3.3-V, crosspoint/exchange, 10-channel FET bus switch

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3.3-V, crosspoint/exchange, 10-channel FET bus switch

SN74CBTLV3383

ACTIVE

Product details

Parameters

Configuration Crosspoint/exchange Number of channels (#) 10 Power supply voltage - single (V) 2.5, 3.3 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (C) -40 to 85 Features Powered-off protection Input/output continuous current (Max) (mA) 128 Rating Catalog open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (DW) 24 160 mm² 15.5 x 10.3 SSOP (DBQ) 24 52 mm² 8.65 x 6 TSSOP (PW) 24 34 mm² 4.4 x 7.8 TVSOP (DGV) 24 32 mm² 5 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • 5-Ω Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A
    • 200-V Machine Model (A115-A)

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Description

The SN74CBTLV3383 provides ten bits of high-speed bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device operates as a 10-bit bus switch or as a 5-bit bus exchanger, which provides swapping of the A and B pairs of signals. The bus-exchange function is selected when BX is high, and BE is low.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

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Technical documentation

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Type Title Date
* Datasheet SN74CBTLV3383 Low-Voltage 10-Bit FET Bus-Exchange Switch datasheet (Rev. H) Nov. 14, 2018
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
User guide CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) Dec. 01, 1998

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODEL Download
SCDJ025A.ZIP (99 KB) - HSpice Model
SIMULATION MODEL Download
SCDM091.ZIP (25 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SOIC (DW) 24 View options
SSOP (DBQ) 24 View options
TSSOP (PW) 24 View options
TVSOP (DGV) 24 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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