SN74CBTS3306

ACTIVE

5-V, 1:1 (SPST), 2-channel FET bus switch with Schottky diode clamping

Top
5-V, 1:1 (SPST), 2-channel FET bus switch with Schottky diode clamping

SN74CBTS3306

ACTIVE

Product details

Parameters

We are not able to display this information. Please refer to the product data sheet.

Package | Pins | Size

SOIC (D) 8 19 mm² 3.91 x 4.9 TSSOP (PW) 8 19 mm² 3 x 6.4 open-in-new Find other Analog switches & muxes

Features

  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels

open-in-new Find other Analog switches & muxes

Description

The SN74CBTS3306 features independent line switches with Schottky diodes on the I/Os to clamp undershoot. Each switch is disabled when the associated output-enable (OE\) input is high.

open-in-new Find other Analog switches & muxes
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 28
Type Title Date
* Datasheet SN74CBTS3306 datasheet (Rev. I) Jan. 15, 2004
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes How to Select Little Logic (Rev. A) Jul. 26, 2016
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Digital Bus Switch Selection Guide (Rev. A) Nov. 10, 2004
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
More literature CBT RAID Application Clip Jun. 12, 2003
Application notes Bus FET Switch Solutions for Live Insertion Applications Feb. 07, 2003
Application notes Texas Instruments Little Logic Application Report Nov. 01, 2002
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application notes 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application notes Flexible Voltage-Level Translation With CBT Family Devices Jul. 20, 1999
User guides CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B) Dec. 01, 1998
Application notes 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A) Apr. 03, 1998
Application notes Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application notes 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B) Mar. 01, 1997
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODELS Download
SCDM005.ZIP (24 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SOIC (D) 8 View options
TSSOP (PW) 8 View options

Ordering & quality

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos