SN74F240

ACTIVE

Octal buffers and line drivers

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Product details

Parameters

Technology Family F VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Channels (#) 8 IOL (Max) (mA) 64 IOH (Max) (mA) -15 ICC (Max) (uA) 75 Input type Bipolar Output type 3-State Features Very high speed (tpd 5-10ns), Over-voltage tolerant inputs Data rate (Mbps) 140 Rating Catalog open-in-new Find other Inverting buffer/driver

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 open-in-new Find other Inverting buffer/driver

Features

  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
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Description

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F241 and ´F244, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´F240 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN74F240 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F240 is characterized for operation from 0°C to 70°C.

 

 

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. A) Oct. 01, 1993
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes Designing With Logic (Rev. C) Jun. 01, 1997
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996

Design & development

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Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODELS Download
SDFM007A.ZIP (6 KB) - IBIS Model
SIMULATION MODELS Download
SDFM023.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options

Ordering & quality

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