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Product details

Parameters

Technology Family F VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Bits (#) 8 Voltage (Nom) (V) 5 F @ nom voltage (Max) (MHz) 70 ICC @ nom voltage (Max) (mA) 0.12 Propagation delay (Max) (ns) 7 IOL (Max) (mA) 64 IOH (Max) (mA) -15 Rating Catalog Operating temperature range (C) 0 to 70 open-in-new Find other Standard transceiver

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 open-in-new Find other Standard transceiver

Features

  • 3-State Outputs Drive Bus Lines Directly
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
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Description

These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction-control (DIR) input. The output enable input can be used to disable the device so the buses are effectively isolated.

The SN74F245 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F245 is characterized for operation from 0°C to 70°C.

 

 

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Technical documentation

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Type Title Date
* Datasheet Octal Bus Transceivers With 3-State Outputs datasheet (Rev. A) Oct. 01, 1993
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes Designing With Logic (Rev. C) Jun. 01, 1997
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
$10.00
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODELS Download
SDFM009A.ZIP (6 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options

Ordering & quality

Support & training

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