SN74HC4852-Q1

ACTIVE

Automotive 5-V, 4:1, 2-channel analog multiplexer with injection-current effect control

Top
Automotive 5-V, 4:1, 2-channel analog multiplexer with injection-current effect control

SN74HC4852-Q1

ACTIVE

Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Power supply voltage - single (V) 2.5, 3.3, 5 Ron (Typ) (Ohms) 150 ON-state leakage current (Max) (µA) 1 Operating temperature range (C) -40 to 125 Input/output continuous current (Max) (mA) 25 Rating Automotive CON (Typ) (pF) 6.7 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • Injection-Current Cross Coupling <1 mV/mA (see Figure 1)
  • Low Crosstalk Between Switches
  • Pin Compatible With SN74HC4052, SN74LV4052A, and CD4052B
  • 2-V to 6-V VCC Operation

open-in-new Find other Analog switches & muxes

Description

This dual 4-to-1 CMOS analog multiplexer/demultiplexer is pin compatible with the 4052 function and also features injection-current effect control. This feature has excellent value in automotive applications where voltages in excess of normal supply voltages are common.

The injection-current effect control allows signals at disabled analog input channels to exceed the supply voltage without affecting the signal of the enabled analog channel. This eliminates the need for external diode/resistor networks typically used to keep the analog channel signals within the supply voltage range.

open-in-new Find other Analog switches & muxes
Download
Similar products you might be interested in
open-in-new Compare products
Exact equivalent in functionality and parametrics to the compared device:
NEW TMUX1309-Q1 ACTIVE Automotive, 2-channel, 4:1 general-purpose analog multiplexer with 1.8-V logic control Upgraded 1.8-V logic support and smaller package options 

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 18
Type Title Date
* Datasheet Dual 4-to-1 Channel Analog Multiplexer/Demultiplexer datasheet (Rev. A) Feb. 14, 2008
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
More literature Automotive Logic Devices Brochure Aug. 27, 2014
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions May 01, 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc Apr. 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos